 Subjects -> ELECTRONICS (Total: 207 journals)
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- Lifetime modelling of solder joints based on accelerated mechanical
testing and Finite Element Analysis
Abstract: Publication date: Available online 25 January 2023Source: Power Electronic Devices and ComponentsAuthor(s): M. Lederer, A. Betzwar Kotas, G. Khatibi
- Impact of Post-Deposition Anneal on ALD Al2O3/etched GaN Interface for
Gate-First MOSc-HEMT
Abstract: Publication date: Available online 13 January 2023Source: Power Electronic Devices and ComponentsAuthor(s): P. Fernandes Paes Pinto Rocha, L. Vauche, B. Mohamad, W. Vandendaele, E. Martinez, M. Veillerot, T. Spelta, N. Rochat, R. Gwoziecki, B. Salem, V. Sousa
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SiN
x
+passivation+with+more+than+8+MV/cm+breakdown+strength+for+GaN-on-Si+wafer+stress+management&rft.title=Power+Electronic+Devices+and+Components&rft.issn=2772-3704&rft.date=&rft.volume=">PECVD SiN
x passivation with more than 8 MV/cm breakdown strength for
GaN-on-Si wafer stress management
Abstract: Publication date: Available online 29 December 2022Source: Power Electronic Devices and ComponentsAuthor(s): Matthias Moser, Mamta Pradhan, Mohammed Alomari, Michael Heuken, Thomas Schmitt, Ingmar Kallfass, Joachim N. Burghartz
- Simulation Study of a 650V Hybrid-Channel SiC Trench MOSFET with Improved
On-State Performance
Abstract: Publication date: Available online 26 December 2022Source: Power Electronic Devices and ComponentsAuthor(s): L. Zhang, T. Dai, P.M. Gammon, V.A. Shah, P.A. Mawby, M. Antoniou
- A Review of PETT Oscillation's Characteristics, Mechanism, and Suppression
Methods in the IGBT Device
Abstract: Publication date: Available online 16 December 2022Source: Power Electronic Devices and ComponentsAuthor(s): Ganyu Feng, Xuebao Li, Xinling Tang, Xiaoguang Wei, Zhibin Zhao
- Gate Ringing in Superjunction MOSFETs with a Parasitic Capacitance in the
Load Inductor
Abstract: Publication date: Available online 26 November 2022Source: Power Electronic Devices and ComponentsAuthor(s): H. Kang, F. Udrea
- ICeGaNTM technology: the easy-to-use and self-protected GaN
power IC
Abstract: Publication date: Available online 6 November 2022Source: Power Electronic Devices and ComponentsAuthor(s): Giorgia Longobardi, Loizos Efthymiou, John Findlay, Andrea Bricconi, Peter Comiskey, Martin Arnold, David Miller, Florin Udrea
- Advantages of the Extended Finite Element Method for the Analysis of Crack
Propagation in Power
Abstract: Publication date: Available online 1 November 2022Source: Power Electronic Devices and ComponentsAuthor(s): Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey
- Layer-by-layer printable nano-scale polypropylene for precise control of
nanocomposite capacitor dielectric morphologies in metallised film
capacitors
Abstract: Publication date: Available online 30 October 2022Source: Power Electronic Devices and ComponentsAuthor(s): William GREENBANK, Thomas EBEL
- Investigation on safe-operating-area degradation and failure modes of SiC
MOSFETs under repetitive short-circuit conditions
Abstract: Publication date: Available online 28 October 2022Source: Power Electronic Devices and ComponentsAuthor(s): Ziyang Zhang, Lin Liang, Haoyang Fei
- Thick gate oxide extrinsic breakdown – the potential role of neutral
hydrogen atom
Abstract: Publication date: Available online 20 October 2022Source: Power Electronic Devices and ComponentsAuthor(s): Kin P Cheung
- Semi-Additive Patterning process based fabrication of miniaturized,
package-embedded high conversion ratio inductors for DC-DC converters
Abstract: Publication date: Available online 18 September 2022Source: Power Electronic Devices and ComponentsAuthor(s): Prahalad Murali, Claudio Alvarez, Srinidhi Suresh, Mark D. Losego, Madhavan Swaminathan
- Electromagnetic analysis of switching cells with dies embedded in printed
circuit boards: application to TAPIR (compacT and modulAr Power modules
with IntegRated cooling) technology
Abstract: Publication date: Available online 13 September 2022Source: Power Electronic Devices and ComponentsAuthor(s): W-F. Bikinga, Y. Avenas, K. Alkama, B. Mezrag, J-M. Guichon, J-L. Schanen
- Si-IGBT and SiC-MOSFET Hybrid Switch-based 1.7 kV Half-bridge Power Module
Abstract: Publication date: Available online 8 September 2022Source: Power Electronic Devices and ComponentsAuthor(s): Amol Deshpande, Riya Paul, Asif Imran, Zhao Yuan, Hongwu Peng, Fang Luo
- Surface discharge characteristics of silicone gel and DBC under positive
repetitive square voltage
Abstract: Publication date: Available online 7 September 2022Source: Power Electronic Devices and ComponentsAuthor(s): Chao Li, Boyuan Cao, Xuebao Li, Xiangchen Liu, Jinjin Cheng, Zhaocheng Liu, Zhibin Zhao, Zhongguang Yang
- Switching Waveform Design with Gate Charge Control for Power MOSFETs
Abstract: Publication date: Available online 27 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Hirotaka Oomori, Ichiro Omura
- Performance Limits of High Voltage Press-Pack SiC IGBT and SiC MOSFET
Devices
Abstract: Publication date: Available online 25 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Lubin Han, Lin Liang, Yijian Wang, Xinling Tang, Song Bai
- A Self-Powered H-Bridge Joule Theory Circuit for Piezoelectric Energy
Harvesting Systems
Abstract: Publication date: Available online 14 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Mahesh Edla, Mikio Deguchi, Yee Yan Lim
- Printed Circuit Board Embedded Power Semiconductors: A Technology Review
Abstract: Publication date: Available online 13 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Till Huesgen
- Input and output total currents characterization in BCM and CCM
Interleaved Power Converters Under Inductance Mismatch
Abstract: Publication date: Available online 5 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Paula Cervellini, Marco Carnaghi, Pablo Antoszczuk, Rogelio García Retegui, Marcos Funes
- Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low
Temperature of 180°C
Abstract: Publication date: Available online 4 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Bowen Zhang, Shi Chen, Guo-Quan. Lu, Yun-Hui. Mei
- Zero-Ventilated Self-Cooled Induction Heating Device: Topology and
Component Engineering
Abstract: Publication date: Available online 30 July 2022Source: Power Electronic Devices and ComponentsAuthor(s): Arun Kumar Paul
- Research on Long-term Reliability of Silver Sintered Press-Pack IGBT
Modules
Abstract: Publication date: Available online 21 July 2022Source: Power Electronic Devices and ComponentsAuthor(s): Renkuan Liu, Hui Li, Ran Yao, Xiao Wang, Hongtao Tan, Wei Lai, Yue Yu, Zheyan Zhu, Bailing Zhou
- Single terminal and double terminal coil shape analysis using capacitive
power transmission for biomedical implant
Abstract: Publication date: Available online 11 June 2022Source: Power Electronic Devices and ComponentsAuthor(s): Yen Po Wang, Shin'ichi Warisawa
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