JournalTOCs

About Help News

Power Electronic Devices and Components
Number of Followers: 6

This is an Open Access Journal

Open Access journal
ISSN (Online) 2772-3704
Published by Elsevier

[2974 journals]

Lifetime modelling of solder joints based on accelerated mechanical
testing and Finite Element Analysis
- Abstract: Publication date: Available online 25 January 2023Source: Power Electronic Devices and ComponentsAuthor(s): M. Lederer, A. Betzwar Kotas, G. Khatibi
Impact of Post-Deposition Anneal on ALD Al2O3/etched GaN Interface for
Gate-First MOSc-HEMT
- Abstract: Publication date: Available online 13 January 2023Source: Power Electronic Devices and ComponentsAuthor(s): P. Fernandes Paes Pinto Rocha, L. Vauche, B. Mohamad, W. Vandendaele, E. Martinez, M. Veillerot, T. Spelta, N. Rochat, R. Gwoziecki, B. Salem, V. Sousa
SiN x +passivation+with+more+than+8+MV/cm+breakdown+strength+for+GaN-on-Si+wafer+stress+management&rft.title=Power+Electronic+Devices+and+Components&rft.issn=2772-3704&rft.date=&rft.volume=">PECVD SiN x passivation with more than 8 MV/cm breakdown strength for
GaN-on-Si wafer stress management
- Abstract: Publication date: Available online 29 December 2022Source: Power Electronic Devices and ComponentsAuthor(s): Matthias Moser, Mamta Pradhan, Mohammed Alomari, Michael Heuken, Thomas Schmitt, Ingmar Kallfass, Joachim N. Burghartz
Simulation Study of a 650V Hybrid-Channel SiC Trench MOSFET with Improved
On-State Performance
- Abstract: Publication date: Available online 26 December 2022Source: Power Electronic Devices and ComponentsAuthor(s): L. Zhang, T. Dai, P.M. Gammon, V.A. Shah, P.A. Mawby, M. Antoniou
A Review of PETT Oscillation's Characteristics, Mechanism, and Suppression
Methods in the IGBT Device
- Abstract: Publication date: Available online 16 December 2022Source: Power Electronic Devices and ComponentsAuthor(s): Ganyu Feng, Xuebao Li, Xinling Tang, Xiaoguang Wei, Zhibin Zhao
Gate Ringing in Superjunction MOSFETs with a Parasitic Capacitance in the
Load Inductor
- Abstract: Publication date: Available online 26 November 2022Source: Power Electronic Devices and ComponentsAuthor(s): H. Kang, F. Udrea
ICeGaN^TM technology: the easy-to-use and self-protected GaN
power IC
- Abstract: Publication date: Available online 6 November 2022Source: Power Electronic Devices and ComponentsAuthor(s): Giorgia Longobardi, Loizos Efthymiou, John Findlay, Andrea Bricconi, Peter Comiskey, Martin Arnold, David Miller, Florin Udrea
Advantages of the Extended Finite Element Method for the Analysis of Crack
Propagation in Power
- Abstract: Publication date: Available online 1 November 2022Source: Power Electronic Devices and ComponentsAuthor(s): Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey
Layer-by-layer printable nano-scale polypropylene for precise control of
nanocomposite capacitor dielectric morphologies in metallised film
capacitors
- Abstract: Publication date: Available online 30 October 2022Source: Power Electronic Devices and ComponentsAuthor(s): William GREENBANK, Thomas EBEL
Investigation on safe-operating-area degradation and failure modes of SiC
MOSFETs under repetitive short-circuit conditions
- Abstract: Publication date: Available online 28 October 2022Source: Power Electronic Devices and ComponentsAuthor(s): Ziyang Zhang, Lin Liang, Haoyang Fei
Thick gate oxide extrinsic breakdown – the potential role of neutral
hydrogen atom
- Abstract: Publication date: Available online 20 October 2022Source: Power Electronic Devices and ComponentsAuthor(s): Kin P Cheung
Semi-Additive Patterning process based fabrication of miniaturized,
package-embedded high conversion ratio inductors for DC-DC converters
- Abstract: Publication date: Available online 18 September 2022Source: Power Electronic Devices and ComponentsAuthor(s): Prahalad Murali, Claudio Alvarez, Srinidhi Suresh, Mark D. Losego, Madhavan Swaminathan
Electromagnetic analysis of switching cells with dies embedded in printed
circuit boards: application to TAPIR (compacT and modulAr Power modules
with IntegRated cooling) technology
- Abstract: Publication date: Available online 13 September 2022Source: Power Electronic Devices and ComponentsAuthor(s): W-F. Bikinga, Y. Avenas, K. Alkama, B. Mezrag, J-M. Guichon, J-L. Schanen
Si-IGBT and SiC-MOSFET Hybrid Switch-based 1.7 kV Half-bridge Power Module
- Abstract: Publication date: Available online 8 September 2022Source: Power Electronic Devices and ComponentsAuthor(s): Amol Deshpande, Riya Paul, Asif Imran, Zhao Yuan, Hongwu Peng, Fang Luo
Surface discharge characteristics of silicone gel and DBC under positive
repetitive square voltage
- Abstract: Publication date: Available online 7 September 2022Source: Power Electronic Devices and ComponentsAuthor(s): Chao Li, Boyuan Cao, Xuebao Li, Xiangchen Liu, Jinjin Cheng, Zhaocheng Liu, Zhibin Zhao, Zhongguang Yang
Switching Waveform Design with Gate Charge Control for Power MOSFETs
- Abstract: Publication date: Available online 27 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Hirotaka Oomori, Ichiro Omura
Performance Limits of High Voltage Press-Pack SiC IGBT and SiC MOSFET
Devices
- Abstract: Publication date: Available online 25 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Lubin Han, Lin Liang, Yijian Wang, Xinling Tang, Song Bai
A Self-Powered H-Bridge Joule Theory Circuit for Piezoelectric Energy
Harvesting Systems
- Abstract: Publication date: Available online 14 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Mahesh Edla, Mikio Deguchi, Yee Yan Lim
Printed Circuit Board Embedded Power Semiconductors: A Technology Review
- Abstract: Publication date: Available online 13 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Till Huesgen
Input and output total currents characterization in BCM and CCM
Interleaved Power Converters Under Inductance Mismatch
- Abstract: Publication date: Available online 5 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Paula Cervellini, Marco Carnaghi, Pablo Antoszczuk, Rogelio García Retegui, Marcos Funes
Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low
Temperature of 180°C
- Abstract: Publication date: Available online 4 August 2022Source: Power Electronic Devices and ComponentsAuthor(s): Bowen Zhang, Shi Chen, Guo-Quan. Lu, Yun-Hui. Mei
Zero-Ventilated Self-Cooled Induction Heating Device: Topology and
Component Engineering
- Abstract: Publication date: Available online 30 July 2022Source: Power Electronic Devices and ComponentsAuthor(s): Arun Kumar Paul
Research on Long-term Reliability of Silver Sintered Press-Pack IGBT
Modules
- Abstract: Publication date: Available online 21 July 2022Source: Power Electronic Devices and ComponentsAuthor(s): Renkuan Liu, Hui Li, Ran Yao, Xiao Wang, Hongtao Tan, Wei Lai, Yue Yu, Zheyan Zhu, Bailing Zhou
Single terminal and double terminal coil shape analysis using capacitive
power transmission for biomedical implant
- Abstract: Publication date: Available online 11 June 2022Source: Power Electronic Devices and ComponentsAuthor(s): Yen Po Wang, Shin'ichi Warisawa

JournalTOCs
School of Mathematical and Computer Sciences
Heriot-Watt University
Edinburgh, EH14 4AS, UK
Email: journaltocs@hw.ac.uk
Tel: +00 44 (0)131 4513762

Your IP address: 3.237.29.69

Home (Search)
API
About JournalTOCs
News (blog, publications)