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  Subjects -> ELECTRONICS (Total: 207 journals)
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Nature Electronics
Number of Followers: 13  
 
  Hybrid Journal Hybrid journal (It can contain Open Access articles)
ISSN (Online) 2520-1131
Published by NPG Homepage  [139 journals]
  • Stress monitoring with wearable technology and AI

    • Free pre-print version: Loading...

      Nature Electronics, Published online: 23 February 2024; doi:10.1038/s41928-024-01128-w

      Physicochemical-sensing electronic skins — combined with artificial intelligence — could be used to develop personalized stress management systems.Nature Electronics, Published online: 2024-02-23; doi:10.1038/s41928-024-01128-w2024-02-23
      DOI: 10.1038/s41928-024-01128-w
       
  • Monolithically integrated high-density vertical organic electrochemical
           transistor arrays and complementary circuits

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      Nature Electronics, Published online: 21 February 2024; doi:10.1038/s41928-024-01127-x

      Micropatterning of organic semiconductors by electron-beam exposure can be used to create vertical organic electrochemical transistor arrays and complementary logic circuits with densities of up to 7.2 million transistors per cm2.Nature Electronics, Published online: 2024-02-21; doi:10.1038/s41928-024-01127-x2024-02-21
      DOI: 10.1038/s41928-024-01127-x
       
  • Imaging circuits in three dimensions

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      Nature Electronics, Published online: 20 February 2024; doi:10.1038/s41928-024-01131-1

      Imaging circuits in three dimensionsNature Electronics, Published online: 2024-02-20; doi:10.1038/s41928-024-01131-12024-02-20
      DOI: 10.1038/s41928-024-01131-1
       
  • A fabrication process to reduce stress

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      Nature Electronics, Published online: 20 February 2024; doi:10.1038/s41928-024-01132-0

      A fabrication process to reduce stressNature Electronics, Published online: 2024-02-20; doi:10.1038/s41928-024-01132-02024-02-20
      DOI: 10.1038/s41928-024-01132-0
       
  • High-performance, power-efficient three-dimensional system-in-package
           designs with universal chiplet interconnect express

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      Nature Electronics, Published online: 19 February 2024; doi:10.1038/s41928-024-01126-y

      Developments in universal chiplet interconnect express could be used to construct three-dimensional system-on-chip design architectures that offer power, performance and reliability characteristics approaching or exceeding those of current monolithic system-on-chip designs as the bump interconnect pitch approaches 1 µm.Nature Electronics, Published online: 2024-02-19; doi:10.1038/s41928-024-01126-y2024-02-19
      DOI: 10.1038/s41928-024-01126-y
       
  • Pixel-correlated computing for detecting and tracking targets in dim
           lighting

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      Nature Electronics, Published online: 14 February 2024; doi:10.1038/s41928-024-01125-z

      An approach to dynamically control the photoresponsivity of pixels in a computational sensor based on local image gradients enables the precise and robust detection of edge features of targets in dim light conditions from a single image capture.Nature Electronics, Published online: 2024-02-14; doi:10.1038/s41928-024-01125-z2024-02-14
      DOI: 10.1038/s41928-024-01125-z
       
  • Wafer-scale transfer of two-dimensional materials with UV tape

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      Nature Electronics, Published online: 09 February 2024; doi:10.1038/s41928-024-01117-z

      Tapes whose adhesive force is controlled by ultraviolet illumination can be used to cleanly transfer large-area graphene, molybdenum disulfide and other two-dimensional materials with a low thermal budget and using no organic solvents.Nature Electronics, Published online: 2024-02-09; doi:10.1038/s41928-024-01117-z2024-02-09
      DOI: 10.1038/s41928-024-01117-z
       
  • Ready-to-transfer two-dimensional materials using tunable adhesive force
           tapes

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      Nature Electronics, Published online: 09 February 2024; doi:10.1038/s41928-024-01121-3

      Large-area two-dimensional materials can be transferred at low temperatures and without solvents using conformable tapes whose adhesive force varies with ultraviolet illumination, allowing transfer to various planar and non-planar substrates.Nature Electronics, Published online: 2024-02-09; doi:10.1038/s41928-024-01121-32024-02-09
      DOI: 10.1038/s41928-024-01121-3
       
 
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  Subjects -> ELECTRONICS (Total: 207 journals)
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