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  Subjects -> ELECTRONICS (Total: 207 journals)
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Electronic Design
Number of Followers: 124  
 
  Partially Free Journal Partially Free Journal
ISSN (Print) 0013-4872
Published by Penton Media Homepage  [2 journals]
  • TIACC: A Collaboration to Accelerate Coexistence

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      Abstract: Time-sensitive networking enables industrial and non-industrial protocols to run on the same physical wire, enabling IT and OT systems to work together. TIACC brings competitors together to validate these TSN solutions for better interoperability.
      PubDate: Aug 9th 2022
       
  • Proximity Sensor Travels a New Path

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      Authors: bwong@endeavorb2b.com (William G. Wong
      Abstract: STMicroelectronics' engineer Tom Bocchino explains how the company's TMOS sensor can detect human presence and proximity.
      PubDate: Aug 9th 2022
       
  • SDR vs. RFSoC: What’s the Better Transceiver'

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      Abstract: Software-defined radio or radio-frequency system-on-chip' This article compares the two technologies and weighs their advantages and disadvantages for different connectivity applications.
      PubDate: Aug 9th 2022
       
  • Touch-Panel Controller IC Also “Plays Well” with Rotary
           Mechanical Knob

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      Abstract: Integrating touchscreen and rotary-knob control into a single IC simplifies combining these two different but complementary user-input devices.
      PubDate: Aug 9th 2022
       
  • The Electronic Clocks of Patek Philippe Once Ran the World

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      Authors: apaultre@endeavorb2b.com (Alix Paultre; Editor
      Abstract: We visit the largest collection of Patek Philippe electronic clocks ever assembled for public viewing, in New York City.
      PubDate: Aug 9th 2022
       
  • Improving the Stacked Load Architecture

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      Abstract: This article presents a stacked load prototype that achieves >95% efficiency at a full load of 450 W, and discusses a critical enhancement in the Energy Exchanger.
      PubDate: Aug 8th 2022
       
  • Radar Handles Room Monitoring and Various Other Apps

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      Authors: bwong@endeavorb2b.com (William G. Wong
      Abstract: Infineon's Bob Williams demos the company's radar technology in a home-entertainment room scenario.
      PubDate: Aug 8th 2022
       
  • Meet George Jetson: Rolls-Royce and Hyundai to Develop Flying Cars

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      Abstract: In a full-speed-ahead sprint toward flying vehicles, a collaborative effort will combine Rolls-Royce’s aviation expertise with Hyundai’s hydrogen fuel-cell technology to deliver a fuel-cell electric aircraft demonstrator by 2025.
      PubDate: Aug 8th 2022
       
  • Module Integrates 3D Time-of-Flight Sensor

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      Authors: bwong@endeavorb2b.com (William G. Wong
      Abstract: Analog Devices' Erik Barnes shows off a power-efficient, 1-Mpixel, 3D ToF sensor module.
      PubDate: Aug 8th 2022
       
  • Top Stories of the Week - Aug. 1, 2022

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      PubDate: Aug 6th 2022
       
  • Products of the Week: MCUs with CAN FD, PCIe Gen 5 NVMe SSDs

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      Authors: jmorra@endeavorb2b.com (James Morra
      Abstract: Check out some of the latest electronic products and solutions to hit the market.
      PubDate: Aug 5th 2022
       
  • Advanced Pressure Sensing Using a Modular Approach

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      Authors: bwong@endeavorb2b.com (William G. Wong
      Abstract: Superior Sensor Technology's Anthony Gioeli describes the company's modular and multiconfiguration pressure-sensing modules.
      PubDate: Aug 5th 2022
       
  • The Golden Rule of Board Layout for SMPS

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      Abstract: One factor tops all others in optimizing board layout for switched-mode power supplies, and it has to do with designing traces, especially in terms of their length.
      PubDate: Aug 4th 2022
       
  • Harnessing the Potential of Zonal Architectures to Build Next-Gen Vehicles

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      Abstract: Looking for ways to shrink weight and cost, as well as simplify connectivity, in next-gen automotive designs, engineers are turning to zonal architectures.
      PubDate: Aug 4th 2022
       
  • 3D NAND Flash Memory Stacked High at Micron

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      Authors: jmorra@endeavorb2b.com (James Morra
      Abstract: The company has started mass production of its most advanced 3D NAND chips made up of 232 layers of memory cells. The competition sits close behind.
      PubDate: Aug 4th 2022
       
  • The Importance of Design Collaboration in Electronics Today

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      Authors: apaultre@endeavorb2b.com (Alix Paultre; Editor
      Abstract: The ability to understand and integrate every core technology and methodology in an advanced system is beyond most individuals, so collaboration is becoming more and more important in electronic design.
      PubDate: Aug 4th 2022
       
  • Timing Decisions 101: Oscillator or Clock'

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      Abstract: Here’s a basic guide for considering the timing solution that’s optimal for the technologies and applications being developed today.
      PubDate: Aug 3rd 2022
       
  • NVIDIA Joins Push to Create Standard Chiplet Interconnect

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      Authors: jmorra@endeavorb2b.com (James Morra
      Abstract: The company is putting its weight behind the emerging UCIe standard for universal chiplet connectivity.
      PubDate: Aug 3rd 2022
       
  • Spotlight on IoT Kits and an FPGA Test System

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      Authors: bwong@endeavorb2b.com (William G. Wong
      Abstract: Digi-Key's Scott Raker shows off some IoT kits and an FPGA-based test-and-measurement platform at Sensors Converge.
      PubDate: Aug 3rd 2022
       
  • Nanoflyer Uses Embedded EL Flashers for Tracking, Signaling

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      Abstract: This paper-clip-sized nanoflyer leverages integral electroluminescence, rather than LEDs, to emit light when flying for motion tracking and signaling.
      PubDate: Aug 3rd 2022
       
  • Data-Analytics Solution Performs Health and Performance Monitoring

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      Authors: apaultre@endeavorb2b.com (Alix Paultre; Editor
      Abstract: Uzi Baruch, Chief Strategy Officer at proteanTec, discusses the company's data-analytics platform that provides system health and performance monitoring from production to the field.
      PubDate: Aug 3rd 2022
       
  • Automotive High-Side Switch Controller Integrates Fuse Protection

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      Abstract: STMicroelectronics’ new controller for a power MOSFET is designed to implement an intelligent high-side switch for 12-, 24-, and 48-V automotive applications.
      PubDate: Aug 2nd 2022
       
  • Top Stories of the Week - Aug. 8, 2022

    • Free pre-print version: Loading...

      Abstract: Here's a rundown of some of the stories that made news this past week.
      PubDate: Aug 13th 2022
       
  • Products of the Week: ESD Protection Diodes, Edge AI SSDs

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      Abstract: From high-voltage IGBTs to 50-MP image sensors, here are some of the latest products to hit the market.
      PubDate: Aug 12th 2022
       
  • Micron Pledges to Invest $40 Billion in U.S. Memory Fabs

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      Authors: jmorra@endeavorb2b.com (James Morra
      Abstract: The memory chip giant said that it plans to start mass-producing chips at its new U.S. fabs after 2025.
      PubDate: Aug 10th 2022
       
 
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