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IEEE Solid-State Circuits Magazine
Journal Prestige (SJR): 0.228
Citation Impact (citeScore): 1
Number of Followers: 13  
 
  Hybrid Journal Hybrid journal (It can contain Open Access articles)
ISSN (Print) 1943-0582 - ISSN (Online) 1943-0590
Published by IEEE Homepage  [228 journals]
  • IEEE Collabratec

    • Free pre-print version: Loading...

      Abstract: Advertisement.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Conference Calendar [Conference Calendar]

    • Free pre-print version: Loading...

      Abstract: Presents the SSCS calendar of upcoming events and meetings.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • TechRxiv: Share Your Preprint Research With the World!

    • Free pre-print version: Loading...

      Abstract: Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • 2022 Index IEEE Solid-State Circuits Magazine Vol. 14

    • Free pre-print version: Loading...

      Pages: 1 - 7
      Abstract: Presents the 2022 author/subject annual index.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Contributor’s List

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      Pages: 3 - 3
      Abstract: Presents a listing of authors who contributed to articles in this issue of the publication.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Welcome to the Fall 2022 Issue of IEEE Solid-State Circuits Magazine!
           [Editor’s Note]

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      Authors: Leo Belostotski;
      Pages: 4 - 4
      Abstract: The theme of this fourth issue of the 14th year of the magazine is “Women in Circuits.” This year’s guest editor, Qun Jane Gu, has invited four contributions from female leaders in the IEEE Solid-State Circuits Society (SSCS). “Women in Circuits” issues strive to promote diversity in the SSCS with the vision to inspire younger readers, to improve the advancement of female members, and to increase the visibility of women within the SSCS.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • IEEE Feedback

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      Pages: 4 - 4
      Abstract: Advertisement.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Young Professionals [President’s Corner]

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      Authors: John R. Long;
      Pages: 5 - 5
      Abstract: Building your career is a project for a lifetime. We devote a lot of time and energy to developing hard and soft skills and building an enduring and diverse professional network. Our career goals and the image we project professionally to others are often influenced or shaped by mentors and role models. Certainly, mentorship and mentoring are often cited by IEEE Solid-State Circuits Society (SSCS) members as one of the main reasons they join our Society. With 10,000 members as well as regular meetings held locally by Chapters and internationally at conferences, there are plenty of informal opportunities to engage with others to support your career development. Mentoring others is also an excellent opportunity to invest in future engineering talent and promote our profession.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • The Design of a Millimeter-Wave Frequency Divider [The Analog Mind]

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      Authors: Behzad Razavi;
      Pages: 6 - 16
      Abstract: Following the design of a millimeter-wave VCO in the previous issue [1], we now turn to the feedback frequency divider that would be driven by the VCO in a PLL. We assume that the PLL receives a reference frequency of 50 MHz and generates an output frequency ranging from 28 to 32 GHz.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • VDD is not your BFF: Four things you didn’t know could go wrong [Shop
           Talk: What You Didn’t Learn in School]

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      Authors: Chris Mangelsdorf;
      Pages: 11 - 16
      Abstract: Somewhere on your schematic, there is a small circle. It’s probably labeled VDD or AVDD or something equally innocuous. But that harmless-looking circle embodies the biggest lie in the industry (see Figure 1). Nobody knows the full extent of the damage that circle causes, but a conservative guess is that it’s responsible for at least 90% of silicon failures and redesigns. That circle is your power supply. And it is almost certainly doing you wrong.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Women in Circuits [Guest Editorial]

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      Authors: Qun Jane Gu;
      Pages: 17 - 17
      Abstract: The fall 2022 issue of IEEE Solid-State Circuits Magazine, on “Women in Circuits (WiC),” follows the tradition of previous issues since 2017, enabling more exposure to female leaders through exposition of their work in circuits and systems on a variety of important topics or their personal life/career experiences. WiC is also committed to promoting female leaders and diversity in the IEEE Solid-State Circuits Society (SSCS) and (co)organizing a variety of events to serve our communities, such as mentorship events at different conferences, including the International Solid-State Circuits Conference (ISSCC), the IEEE Symposium on VLSI Technology and Circuits (the VLSI Symposium), the IEEE Custom Integrated Circuits Conference (CICC), and the IEEE Asian Solid-State Circuits Conference (A-SSCC), among others. The WiC Committee would like to encourage more people to participate in future events. The following SSCS members were asked to contribute to this issue.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • ML Processors Are Going Multi-Core: A performance dream or a scheduling
           nightmare'

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      Authors: Marian Verhelst;Man Shi;Linyan Mei;
      Pages: 18 - 27
      Abstract: Applications of machine learning (ML) increasingly penetrate into our daily routines, our work, and our living environments. In this way, more complex machine intelligence algorithms fundamentally change and enhance the way we live, work, and interact. However, the real-time deployment of these algorithms toward the dreams of smart spaces, digital twins, the metaverse, or personalized health care requires a powerful compute continuum from cloud to (extreme) edge, capable of efficiently executing the compute-hungry ML workloads, such as deep neural networks (NNs). To enable the required real-time responsiveness at affordable energy or power budgets, many ML-optimized custom processors (also called accelerators) have been presented over the past decade, as depicted in Figure 1.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • RF Fingerprint Classification With Combinatorial-Randomness-Based Power
           Amplifiers and Convolutional Neural Networks: Secure analog/RF electronics
           and electromagnetics

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      Authors: Vanessa Chen;Jiachen Xu;Yuyi Shen;Ethan Chen;
      Pages: 28 - 36
      Abstract: The growth of the IoT requires more comprehensive security measures than ever. RF fingerprinting (RFF) utilizes features in the signals and waveforms from transmitters’ physical-layer imperfections to classify and authenticate devices. To prevent attacks from impersonators, combinatorial randomness is exploited to augment the RF fingerprints with a high-efficiency PA for IoT applications. By enabling different subsets of thinly sliced PA elements, the transmitter can be reconfigured with 220 subsets that exhibit distinctive RF fingerprints for signal analysis at the edge. In this work, a combinatorial-randomness-based PA was implemented in a BLE system. The BLE packets’ in-phase and quadrature samples transmitted from each configuration are collected with different SNRs to emulate the environmental changes in communication channels. A lightweight convolutional neural network (CNN) classifier demonstrates the possibility of accurate and fast inference of unique features in the IoT environment, which our approach exploits to enable on-chip time-varying RF fingerprints.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Next-Generation Wearable Wireless EEG Recorder: The future of accessible
           neural applications, from mental health monitoring to a noninvasive
           brain–computer interface

    • Free pre-print version: Loading...

      Authors: Cheng Chen;Joonseok Yang;Joanna Sands;Muhammad A. Khan;Ada S.Y. Poon;
      Pages: 37 - 50
      Abstract: EEG recording has been widely used in a variety of applications, including sleep studies, mental health monitoring, brain–computer interfaces (BCIs), etc. However, mainstream clinical recording systems are still tethered with wet electrodes that require special preparation, limiting the setup to well-equipped labs and preventing the collection of longitudinal data. In this article, we summarize the special characteristics of EEG signals and review key circuit design techniques in EEG signal acquisition and data telemetry. With careful system optimization, a wireless distributed recording setup is possible for nonintrusive EEG data collection, which will enable long-term mental health monitoring and other important applications.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Toward Zero: Power consumption trends in low data rate wireless
           connectivity

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      Authors: Danielle Griffith;
      Pages: 51 - 60
      Abstract: The low power IoT market began in earnest in 1999 with the launch of the first commercial Bluetooth device. In 2021, IoT Analytics Research, a market research firm, predicted [1] a yearly 22% growth rate in the global IoT market over the next three years. By 2025, the installed base of active IoT gateways is expected to be 27 billion, not including laptops, tablets, and cellphones. In this projection, gateways are counted, not every sensor. Therefore, the number of connected radios in 2025 is going to be higher than the forecast of 27 billion, perhaps much higher. The IoT market is likely to continue growing past 2025, but this growth rate is unsustainable with today’s technology. This article discusses three limitations to IoT market growth: power, cost, and performance. Examples of innovations needed to enable the predicted market growth will be presented in each area. At the end, a prediction for IoT wireless nodes in the coming decade is presented.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Meet the SSCS PICO Chipathletes [Society News]

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      Authors: Danielle Marinese;
      Pages: 61 - 64
      Abstract: Reports on SSCS Society chapter activities, events, and meetings.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Programmatic analog IC design: MOSAIC bootcamp

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      Authors: Mirjana Videnovic-Misic;
      Pages: 65 - 68
      Abstract: Reports on news of interest to SSCS society members.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Mentors and Mentees Connect at VLSI 2022 [Society News]

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      Authors: Abira Altvater;
      Pages: 69 - 69
      Abstract: Reports on news of interest to SSCS society members.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • IEEE Seoul Chapter Meeting [Chapters]

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      Authors: Tae Wook Kim;
      Pages: 70 - 70
      Abstract: Reports on SSCS Society chapter activities, events, and meetings.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • 2022 IEEE SSCS Kolkata Section Report [Chapters]

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      Authors: Swarnil Roy;
      Pages: 71 - 72
      Abstract: Reports on SSCS Society chapter activities, events, and meetings.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • IEEE SSCS Oregon Chapter Hosts Distinguished Lecturer Dr. Visvesh Sathe
           [Chapters]

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      Authors: Richard Dorrance;Deepak Dasalukunte;
      Pages: 73 - 73
      Abstract: Reports on SSCS Society chapter activities, events, and meetings.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • IEEE App

    • Free pre-print version: Loading...

      Pages: 73 - 73
      Abstract: Advertisement.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • In Step with Yildiz [People]

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      Authors: Yildiz Sinangil;
      Pages: 74 - 76
      Abstract: Presents a profile of Yildiz Sinangil.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • IEEE Connecting

    • Free pre-print version: Loading...

      Pages: 76 - 76
      Abstract: Advertisement.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • Highlights of the 2022 VLSI Symposium

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      Authors: Neale A.W. Dutton;
      Pages: 77 - 82
      Abstract: Presents information on the 2022 VLSI Symposium.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • IEEE Moving

    • Free pre-print version: Loading...

      Pages: 82 - 82
      Abstract: Advertisement.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
  • CEDA Currents [IEEE News]

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      Pages: 83 - 84
      Abstract: Provides several short items that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
      PubDate: Fall 2022
      Issue No: Vol. 14, No. 4 (2022)
       
 
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