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IEEE Solid-State Circuits Magazine
Journal Prestige (SJR): 0.228

Citation Impact (citeScore): 1
Number of Followers: 13

Hybrid journal (It can contain Open Access articles)
ISSN (Print) 1943-0582 - ISSN (Online) 1943-0590
Published by IEEE

[228 journals]

IEEE Collabratec
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  Pages: C2 - C2
  Abstract: Advertisement.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
IEEE Access
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  Pages: C3 - C3
  Abstract: Presents information on the above named publication.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
TechRxiv: Share Your Preprint Research With the World!
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  Pages: C4 - C4
  Abstract: Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
[Contributors]
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  Pages: 3 - 3
  Abstract: Presents information on authors contributing articles for this issue of the publication.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Welcome to the Winter 2023 Issue of IEEE Solid-State Circuits Magazine!
[Editor’s Note]
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  Authors: Leo Belostotski;
  Pages: 4 - 4
  Abstract: This first issue of the 15th year of IEEE Solid-State Circuits Magazine is dedicated to the 2023 IEEE Donald O. Pederson Award in Solid-State Circuits and the 70th anniversary of the International Solid-State Circuits Conference (ISSCC). The 2023 theme for ISSCC is “Building on 70 Years of Innovation in Solid-State Circuit Design.” At this year’s ISSCC, the 2023 IEEE Donald O. Pederson Award in Solid-State Circuits will be officially announced. This year’s award goes to Dr. Ingrid Verbauwhede “for pioneering contributions to energy-efficient and high-performance secure integrated circuits and systems.”
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Closing the Gender Gap in Our Field [President’s Corner]
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  Authors: John R. Long;
  Pages: 5 - 6
  Abstract: Apple chief executive Tim Cook says there are “not enough women at the table” at technology firms, including Apple. In a recent interview, Cook said that technology “will not achieve nearly what it could achieve” without a more diverse workforce. He also said that there were “no good excuses” for the lack of women in the tech sector.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
IEEE Connecting
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  Pages: 6 - 6
  Abstract: Advertisement.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
The Design of a Transimpedance Amplifier [The Analog Mind]
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  Authors: Behzad Razavi;
  Pages: 7 - 11
  Abstract: High-speed transimpedance amplifiers (TIAs) serve in the front end of optical communication receivers (RXs). Despite or because of their simple topologies, TIAs pose rigid tradeoffs among their gain, noise, and bandwidth (BW).
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
IEEE Feedback
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  Pages: 11 - 11
  Abstract: Advertisement.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
The Plan B Toolkit: Debug a high-speed ADC using decimation [Shop Talk:
What You Didn’t Learn in School]
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  Authors: Chris Mangelsdorf;
  Pages: 12 - 94
  Abstract: Debugging high-speed ADCs is a unique challenge because of the enormous rate at which they spew data. Modern devices can fling out 20 GB of data per second. That’s like 250 DVDs worth of information per minute! How’re you going to deal with that' You’re not. That’s the secret.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Voltage Follower, Part II [Circuit Intuitions]
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  Authors: Ali Sheikholeslami;
  Pages: 17 - 19
  Abstract: Welcome to the 34th article in the “Circuit Intuitions” column series. As the title suggests, each article provides insights and intuitions into circuit design and analysis. These articles are aimed at undergraduate students but may serve the interests of other readers as well. If you read this article, I would appreciate your comments and feedback as well as your requests and suggestions for future articles in this series. Please e-mail me your comments at ali@ece.utoronto.ca.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Circuits for Security and Secure Circuits: Implementation of cryptographic
algorithms
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  Authors: Ingrid Verbauwhede;
  Pages: 20 - 24
  Abstract: It is an honor for me to write this overview article and share with the reader the topic of circuits and security. This topic has triggered my curiosity since I started as a Ph.D. student.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Analog Techniques for Digital Security: My gratitudes to visionary
discussions
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  Authors: Makoto Nagata;Noriyuki Miura;Takuji Miki;
  Pages: 25 - 31
  Abstract: Secure functionality plays a crucial part of SoC integration. Cryptographic engines and random number generators establish data encryption and decryption for secure communication. Semiconductor chip-level ID guarantees the authenticity of a secure system, often enhanced with physically unclonable functions (PUFs.) Secure zones are established through security gateways to incoming and outgoing data. Here, data are digitally represented, and digital circuits dominate secure functionalities. “Hardware security” broadly covers technical fields and scientific communities associated with cryptography and the authenticity of electronics. The associated research topics are naturally cross layer among architectures, algorithms, systems, circuits, and assembly techniques to implement, manage, protect, and sustain the security functionality of SoCs.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Security Analysis of IoT Devices: From the system level to the logic level
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  Authors: Endres Puschner;Christof Paar;
  Pages: 32 - 37
  Abstract: IoT devices have become more and more widespread and are playing an important role in the evolving digital society. At the same time, IoT nodes are embedded devices that are always online, often making them interesting targets for potential attackers. Since many IoT applications are closely linked to humans, e. g., medical implants, smart appliances and speakers, and (autonomous) cars, it is of crucial importance that they are trusted to provide safety. Trust in embedded devices is therefore a challenge that concerns industry and policy makers alike. As engineers know, today’s embedded systems are often very complex, consisting of software and firmware, PCBs with digital and analog components and, of course, very complex ICs, which include CPUs that make a device “smart.”
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Preventing a Cryptoapocalypse: From mathematics to circuits for
postquantum cryptography
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  Authors: Sujoy Sinha Roy;Utsav Banerjee;
  Pages: 38 - 44
  Abstract: Communication over the Internet is an integral part of the connected world. As the Internet is a public network, the data packets exchanged by the communicating parties pass through various insecure channels and untrusted servers before they reach their destinations. Still, we feel it is safe to send e-mails, visit social media websites, watch movies of our own preferences online, and shop online using credit cards. Cryptography or encryption makes it possible to protect our private information in the presence of third parties. When we browse a secured website, we see a lock symbol on the browser; it means our communication with the website is encrypted, and hence, no third party will be able to read the data packets exchanged between the browser and the website. Hypertext Transfer Protocol Secure (HTTPS) is used to establish an encrypted, hence secured communication channel between a web browser and a website. The browser website is just one example; cryptography is happening in your mobile phones, smart cards, IoT devices, and in almost all connected devices.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Through the Looking Glass—The 2023 Edition: Trends in solid-state
circuits from ISSCC
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  Authors: Shahriar Mirabbasi;Laura C. Fujino;Kenneth C. Smith;
  Pages: 45 - 62
  Abstract: The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2023 is “Building on 70 Years of Innovation in Solid-State Circuit Design.” The IC design community has proved to be agile and resilient in a world scarred by the worldwide pandemic, and this year’s ISSCC commemorates the 70th anniversary of ISSCC with an edition that is more than ever focused on innovation. To enhance our lives and support increasingly more innovative developments, ISSCC promotes and shares new circuit ideas with potential to advance the state of the art for IC design and enable systems with ever-improving functionality and efficiency.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
IEEE Proceedings
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  Pages: 63 - 63
  Abstract: Presents information on the above named publication.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
ESSCIRC 2022 Hosts Fully In-Person Mentoring Event [Society News]
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  Authors: Danielle Marinese;
  Pages: 64 - 65
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
SSCS Chapter Chairs Gather at ESSCIRC 2022 [Society News]
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  Authors: Danielle Marinese;
  Pages: 66 - 66
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
SCS PICO Chronicles: A μProcessor With a 5-GHz Radio [Society News]
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  Authors: Anhang Li;Wenting Zhang;Mehdi Saligane;
  Pages: 67 - 71
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
[Errata]
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  Authors: Marian Verhelst;
  Pages: 71 - 71
  Abstract: The Fall 2022 issue of IEEE Solid- State Circuits Magazine contained an error in [1]. There are two mistakes in Figure 2. The second “parfor” should be Ku = [0:16): instead of Cu = [0:16):. In addition, the label C0, C1 …. C14, C15 horizontal with the PE row should be K0, K1 …. K14, K15. The revised figured is shown here.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
IEEE SSCS Singapore Chapter Hosts Long-Awaited Social Event [Chapters]
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  Authors: Beng Hwee Ong;Jerald Yoo;
  Pages: 72 - 73
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Global Demand for ADC Design Course
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  Authors: Hooman Reyhani;
  Pages: 73 - 74
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
SSCS Tunisia Chapter and the Newly Formed ENIS Student Chapter Organize
Their First Meeting [Chapters]
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  Authors: Hend Belkhiria;
  Pages: 75 - 75
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
First Organized Event by the New SSCS ENIS Student Chapter: A Session in
the Junior Summer LeadCamp [Chapters]
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  Authors: Hend Belkhiria;
  Pages: 75 - 76
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
SSCS ENIS Student Chapter Organizes Information Booths for ENIS Students
[Chapters]
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  Authors: Hend Belkhiria;
  Pages: 77 - 77
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
First Organized Training by the SSCS ENIS Student Chapter: Circuit
Simulation and PCB Design [Chapters]
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  Authors: Hend Belkhiria;
  Pages: 77 - 78
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
IEEE SSCS USTC Student Branch Chapter Activities [Chapters]
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  Authors: Muhammad Hunain Memon;Fujiang Lin;
  Pages: 79 - 80
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Asia & Pacific (Region 10) [Chapters]
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  Authors: Yansong Yang;
  Pages: 80 - 80
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
SSCS and CASS Tunisia Chapters Jointly Organize a Certified Technical
Training [Chapters]
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  Authors: Brahim Mezghani;
  Pages: 81 - 81
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
SSCS Shanghai Chapter, SSC37 Update [Chapters]
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  Authors: Yun Chen;
  Pages: 82 - 84
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Dr. Zia Karim Technical Talk on “Low-Temperature Polymides for
Interconnect RDL in Next-Generation 3D Advanced IC Backend Packaging
Application” [Chapters]
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  Authors: Bejoy Sikder;
  Pages: 85 - 85
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Autumn 2022 Milestone Looking Back at Switzerland Chapter Activity
[Chapters]
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  Authors: Mathieu Coustans;Michel Bron;Domenico Pepe;Taekwang Jang;
  Pages: 86 - 89
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
The IEEE SSCS Delhi Chapter Organized Three SSCS Distinguished Lectures
and Three Workshop Sessions by Industry Veterans in the Last Five Months
[Chapters]
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  Authors: Ankesh Jain;
  Pages: 90 - 90
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
IEEE Foundation
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  Pages: 91 - 91
  Abstract: Advertisement.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
In Step With Abira Altvater: Stepping Into New Shoes [People]
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  Authors: Danielle Marinese;
  Pages: 92 - 94
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Highlights From CICC 2022 [Conference Reports]
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  Authors: Arijit Raychowdhury;Eric Soenen;Samuel M. Palermo;Christophe Antoine;Fa Foster Dai;Hua Wang;Alessandro Piovaccari;
  Pages: 95 - 97
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
IEEE App
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  Pages: 97 - 97
  Abstract: Advertisement.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
CEDA Currents [IEEE News]
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  Pages: 98 - 99
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
Highlights of SIM 2022 [IEEE News]
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  Authors: Stoyan Nihtianov;Kofi Makinwa;Viola Schaffer;Mirjam-Otten Need;
  Pages: 100 - 103
  Abstract: Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)
[Conference Calendar]
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  Pages: 104 - 104
  Abstract: Presents the SSCS calendar of upcoming events and meetings.
  PubDate: winter 2023
  Issue No: Vol. 15, No. 1 (2023)