Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Leo Belostotski;
Pages: 4 - 4 Abstract: In this first issue of the 14th year of IEEE Solid-State Circuits Magazine, we are pleased to share semiconductor-technology trends as identified by the members of the 12 subcommittees of the International Solid-State Circuits Conference (ISSCC) 2022, which include Analog Systems, Data Converters, Digital Architectures and Systems, Digital Circuits, Imagers, MEMS, Medical, and Display, Machine Learning, Memory, Power Management, Radio-Frequency Circuits, Technology Directions, Wirelss, and Wireline. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
John R. Long;
Pages: 5 - 6 Abstract: Authoritative journals, irresistible conferences, unexplored online resources, and weeknight dining with distinguished experts—these are just a few reasons members value the IEEE Solid-State Circuits Society (SSCS). Technologies created by SSCS members allowed us to work effectively from home, while, almost simultaneously, the profile of our profession was raised tremendously during the COVID-19 pandemic by a spike in the demand for semiconductors. This year is the 25th anniversary of our Society, which originated as a Technical Council of IEEE in the 1960s. As the incoming president, these events and our anniversary year have me thinking about the many ways we serve each other and our profession as SSCS members. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Behzad Razavi;
Pages: 7 - 12 Abstract: As explained in “The Design of an Equalizer—Part One” [1], we wish to develop an equalizer meeting the following performance PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Ali Sheikholeslami;
Pages: 13 - 83 Abstract: Welcome to the 31st article in the “Circuit Intuitions” column series. As the title suggests, each installment provides insights and intuitions into circuit design and analysis. These articles are aimed at undergraduate students but may serve the interests of other readers, as well. If you read this article, I would appreciate your comments and feedback, as well as your requests and suggestions for future articles in this series. Please email me your comments at ali@ece.utoronto.ca. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Chris Mangelsdorf;
Pages: 16 - 96 Abstract: Most converter folks I know are obsessed with spectral performance, and rightly so. After all, most analog-to-digital converters (ADCs) these days work as “waveform coders”; their output is intended for some frequency-domain purpose. Of course, time-domain “measurement” applications are still out there, especially in the high-precision realm, but the communications boom has caused many to abandon integral nonlinearity and differential nonlinearity (DNL) for spurious free dynamic range. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Akira Matsuzawa;
Pages: 22 - 31 Abstract: I graduated with a master’s degree in electronics from the Graduate School of Engineering at Tohoku University in March 1978 and joined Matsushita Electric Industrial Co., Ltd. (currently Panasonic) in April of the same year. After one year of training for new employees, I was assigned to the semiconductor-development division of the Central Research Laboratory, and in April 1979, I started to work as an IC designer. My role was to develop ICs to realize digital video and TV systems, rather than to contribute to the semiconductor business. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Akira Matsuzawa;
Pages: 32 - 36 Abstract: Many analog-to-digital converters (ADCs) that I’ve developed for digital video systems use interpolation techniques. I will explain this technique briefly. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Chorng-Kuang Wang;
Pages: 37 - 40 Abstract: Prof. Matsuzawa and I both joined universities and were moving in the same research direction after we had worked in the industry for some years. We shared the same views concurrently in the early 2000s on CMOS technology potentially for a wireless millimeter-wave (mm-wave) communication SoC [1]. We also agreed that it was less likely to realize an R&D mm-wave system without the collective efforts of the complementary expertise among academia, industry, and government [1]. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Asad Abidi;
Pages: 41 - 44 Abstract: I met Akira Matsuzawa in 1988 at an event that may have some significance in the community of Japanese analog IC designers. The occasion was the second JSAP/IEEE Symposium on VLSI Circuits held in Tokyo. The event was a rump session (a designation unique to this symposium) that turned into an informal congress of the leaders from the major Japanese companies involved in the design of analog-to-digital (A/D) converters (ADCs) for portable video cameras, or camcorders. The event was memorable enough to warrant a listing of its participants (Table 1). PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Athanasios Ramkaj;Marcel J.M. Pelgrom;Michiel S.J. Steyaert;Filip Tavernier;
Pages: 45 - 53 Abstract: The everlasting challenge in the design of every analog-to-digital converter (ADC) lies in maximizing the accuracy·speed÷power product by pushing all metrics toward their desired directions. To this end, tremendous progress has been made in advancing ADC performance both circuit- and architecture-wise. These advances have been captured by means of comparing experimental data points in surveys, with [1] being the most noteworthy. However, such comparisons give an ill-defined view since the data points correspond to different architectures that were optimized under different constraints and implemented in different process nodes. This provides little insight on architectural limits and makes a direct comparison under similar assumptions nontrivial. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Authors:
Shahriar Mirabbasi;Laura C. Fujino;Kenneth C. Smith;
Pages: 54 - 72 Abstract: The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2022 is “Intelligent Silicon for a Sustainable World.” This theme further highlights the fact that to cope with strong environmental changes, the circuit design community is evolving more than ever to support a more sustainable world. Given their widespread use in our everyday lives, without change, ICs will become the dominant energy consumer and source of carbon emissions in the (near) future. Despite phenomenal advances in solid-state circuits and systems, low-power circuit design is becoming increasingly more sophisticated in all application areas, from digital computation and machine learning to analog design. In the context of data communications, advances in wireless and wireline circuits will help optimize local and global communications energy. Various sensors can be deployed to measure environmental data and optimize energy consumption. Power management techniques continue to be an essential aspect of a majority of circuits and systems to extend their lifetime and battery longevity. Furthermore, new technologies are providing opportunities to develop innovative circuits, reduce fabrication impacts, and improve recyclability. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 73 - 75 Abstract: Reports on the SSCS Council's transition to the IEEE Solid-State Circuits Society. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 75 - 76 Abstract: Presents information on the SSCS PICO contestants. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 77 - 82 Abstract: Presents SSCS society award recipients for 2021. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 82 - 82 Abstract: Presents information on the ESSCIRC-ESSDERC 2021 Conference. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 82 - 83 Abstract: Reports on the publication of the first volume of IEEE Open Journal of the Solid-State Circuits Society. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 84 - 85 Abstract: Presents information on various SSCS Society chapters. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 86 - 88 Abstract: Presents information on various SSCS Society chapters. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 88 - 90 Abstract: Reports on the SSCS 2021 International Conference on Microelectronics. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 90 - 92 Abstract: Presents information on various SSCS Society chapters. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 92 - 93 Abstract: Presents information on various SSCS Society chapters. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 93 - 94 Abstract: Presents information on various SSCS Society chapters. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 95 - 96 Abstract: Presents information on various SSCS Society chapters. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 97 - 99 Abstract: Presents a profile of SSCS member Woogeun Rhee. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 100 - 103 Abstract: Reports on the first SSCS Hybrid SSCS Conference. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 103 - 107 Abstract: Presents information on the ESSCIRC-ESSDERC 2021 Conference. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 109 - 111 Abstract: Provides several short items that may include news, reviews or technical notes that should be of interest to practitioners and researchers. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Please help us test our new pre-print finding feature by giving the pre-print link a rating. A 5 star rating indicates the linked pre-print has the exact same content as the published article.
Pages: 112 - 112 Abstract: Provides a notice of upcoming conference events of interest to practitioners and researchers. PubDate:
winter 2022
Issue No:Vol. 14, No. 1 (2022)
Hybrid journal (It can contain Open Access articles)
[228 journals]
