Subjects -> PHYSICS (Total: 857 journals)
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ELECTRICITY AND MAGNETISM (10 journals)

Showing 1 - 10 of 10 Journals sorted alphabetically
Advanced Electromagnetics     Open Access   (Followers: 15)
IEEE Electromagnetic Compatibility Magazine     Full-text available via subscription   (Followers: 14)
IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology     Hybrid Journal   (Followers: 1)
IEEE Letters on Electromagnetic Compatibility Practice and Applications     Hybrid Journal   (Followers: 1)
IEEE Transactions on Electromagnetic Compatibility     Hybrid Journal   (Followers: 30)
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control     Hybrid Journal   (Followers: 8)
International Journal of Bioelectromagnetism     Open Access  
International Journal of Electromagnetics and Applications     Open Access   (Followers: 3)
Journal of Electroceramics     Hybrid Journal  
Magnetochemistry     Open Access  
Similar Journals
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IEEE Electromagnetic Compatibility Magazine
Journal Prestige (SJR): 0.264
Citation Impact (citeScore): 1
Number of Followers: 14  
 
  Full-text available via subscription Subscription journal
ISSN (Print) 2162-2264
Published by IEEE Homepage  [228 journals]
  • Letter from the Editor

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      Pages: 4 - 6
      Abstract: As the year draws to an end, I look back on busy summer and fall seasons, the highlight of which was the 2022 IEEE International Sym-posium on Electromagnetic Compatibility (EMC), Signal and Power Integrity (SIPI). Otherwise known as EMC+SIPI 2022, the first in-person sym-posium held since 2019 in New Orleans, this year's symposium in Spokane was much better than I expected. Quite honestly, the organizing committee and I were concerned how things would go. We worried we were “rusty” after not having an in-person symposium in several years and things might not go as planned. Fortunately our concerns were for naught as the symposium was well attended. Our symposium management team did an excellent job, and the city of Spokane could not have been more welcoming. Plus, there was a wonderful atmosphere generated by the happiness people felt for seeing colleagues in person for the first time in many years.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • President's Message

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      Authors: Vignesh Rajamani;
      Pages: 6 - 7
      Abstract: I want to start this President's Message by thanking the wonderful volunteers that made the 2022 IEEE International Sym-posium on Electromagnetic Compatibility, Signal and Power Integrity (EMC+SIPI) in Spokane, Washington a huge success. As you can imagine, we all walked into it without fully knowing what to expect - How many people are really going to show up' Will they be interested meeting in close quarters' How well are the social events going to be attended' Will people be willing to shake hands with each other' Will we have a good international delegate representation at the symposium' And the answer to every one of these questions was an astounding, “Yes, we are ready!”
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Chapter Chatter

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      Authors: Gabe Alcala;
      Pages: 8 - 18
      Abstract: Welcome back to Chapter Chatter! I hope everyone had a nice summer break and for those of you lucky enough to make it to our symposium in Spokane, Washington, it was great seeing you there! It had been three years since we had an in-person IEEE International EMC+SIPI Symposium so there was a ton of catching up to do with our fellow EMC Society members. It was also nice seeing a new generation of EMC engineers attend and hearing it was their first symposium! Hopefully, it will not be their last. Make sure to see the Call for Papers next year's symposium in Grand Rapids, Michigan, and plan to attend. See the symposium ad on pages 70–72.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • No Gas Tanks in Electric Vehicles - Maybe No Radios, Either

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      Authors: Tom Braxton;
      Pages: 19 - 19
      Abstract: Elon Musk is a name synonymous with whole categories of technology. Think of private space exploration, solar energy, and electric vehicles. Space exploration and solar energy have a sense of romantic adventure. But the pervasive influence of electric vehicles (EVs) touches more people in more ways.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Book Reviews

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      Authors: Bob Olsen;
      Pages: 20 - 21
      Abstract: Recently, I was asked by the American Journal of Physics to provide a review of the 122 page book, “Are Electromagnetic Fields Making Me III' How Electricity and Magnetism Affect our Health” by Bradley J. Roth. Given the topic of the book, I thought that a number of you in the EMC community would be interested and I asked their permission to reprint it here. They graciously agreed. Hence, the following review is “Reproduced from American Journal of Physics 90, 718 (2022); https://doi.org/10.1119/5.0107970 with the permission of the American Association of Physics Teachers.”
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Call for EMC Society Awards Nominations: Nominations Due: February 15,
           2023

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      Authors: Flavia Grassi;
      Pages: 22 - 22
      Abstract: Our Society is successful because of the many volunteers who contribute their time and energy for the good of the EMC Society and their fellow EMC colleagues. The IEEE EMC Society sponsors a number of awards to recognize those people who have made significant contributions to the Society and/or the EMC profession. These awards are presented at the awards luncheon held during the annual symposium. Next year, the awards will be presented on August 3 during the 2023 IEEE International Symposium on EMC+SIPI scheduled from July 31 to August 4 in Grand Rapids, Michigan.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • EMC Personality Profile

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      Authors: Frank Sabath;
      Pages: 23 - 24
      Abstract: With this Personality Profile, I would like to introduce you to one of our Young Professional (YP) Representatives, Pavithrakrishnan (Pavi) Radhakrishnan. Pavithrakrishnan Radhakrishnan was born in Chennai, India, in August 1992. He received the B.E degree in electrical and electronics engineering from Anna University, Chennai, India in 2014 and the M.S. degree in electronic embedded systems from ESIGELEC, Rouen, France, in 2018. He got inspired about EMC and functional safety related to the automotive sector during the masters course with Dr. Abhishek Ramanujan in France. He completed his internship and master thesis with a robotics startup company in France and has visited China during 2017 as part of the project. In 2018, he worked for Magna International in Sailauf, Germany on the BMW-ADCAM project as a hardware development engineer with cross-departmental collaboration with system engineers, FuSa (Functional Safety) teams.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • EMC Society History

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      Authors: Daniel D. Hoolihan;
      Pages: 25 - 25
      Abstract: The History column of the EMC Magazine contains two primary subjects in this issue. The first subject of interest is the traditional 50-25-10 Years Ago perspective and the second subject concentrates on Past-Presidents of the EMC Society.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • 50-25-10 Years Ago: A Review of EMC Society Newsletters

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      Authors: Daniel D. Hoolihan;
      Pages: 26 - 28
      Abstract: The cover story of this issue was “An Invitation” by Howard L. Wolfman, General Chairman, 1972 EMC Symposium.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Presidents of the EMC Society

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      Authors: Daniel David Hoolihan;
      Pages: 29 - 29
      Abstract: There have been 38 Presidents of the EMC Society since its founding in 1957. The current President is Vignesh Rajamani who is serving a two-year term of office encompassing 2022 and 2023.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • IEEE Women in Engineering

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      Authors: Mariya Antyufeyeva;
      Pages: 30 - 31
      Abstract: IEEE Women in Engineering (WIE) is a global network of IEEE members and volunteers dedicated to promoting women engineers and scientists, and inspiring girls around the world to follow their academic interests in a career in engineering and science. Our goal is to facilitate the recruitment and retention of women in technical disciplines globally. We envision a vibrant community of IEEE women and men collectively using their diverse talents to innovate for the benefit of humanity.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • EMC Society Awards

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      Pages: 32 - 37
      Abstract: EMC Society President Vignesh Rajamani presented numerous awards at the annual Awards Luncheon during the 2022 IEEE International Symposium on EMC+SIPI held in Spokane, Washington. He is shown below with some of the awards recipients. For a complete listing of the awards presented in Spokane, please see pages 36–37.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Completed Careers

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      Authors: Alistair Duffy;
      Pages: 38 - 43
      Abstract: The main focus of this quarter's Completed Careers coll umn is Professor Takeo Yoshino. I first met Dr. Yoshino when I joined the EMC Society Board of Directors some years ago. My initial impressions were of an austere and aloof professor. Sometimes first impressions are completely wrong: this is one such time. He was a man of great warmth and a subtle sense of humor that endeared him to all who knew him. It was an honor and a pleasure to have known him! I am pleased that we can learn more about him through some reminiscences of him from students and colleagues to give us a glimpse of his supportive and fatherly nature, as well as his adventurous yet calm self. He was a true giant in our EMC community. You can read a previously published “Personality Profile” of Dr. Yoshino from the Winter 2010 IEEE EMC Newsletter at https://www.emcs.org/acstrial/newsletters/winter10/TakeoYoshino.html
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Scenes from the 2022 IEEE International Symposium on Electromagnetic
           Compatibility (EMC), Signal and Power Integrity (SIPI) in Spokane,
           Washington, August 1-5

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      Pages: 44 - 44
      Abstract: Presents information on the 2022 IEEE International Symposium on Electromagnetic Compatibility (EMC), Signal and Power Integrity (SIPI).
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Practical Papers, Articles and Application Notes

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      Authors: Kye Yak See;
      Pages: 45 - 45
      Abstract: Accurate impedance measurement across a wide frequency range is important to construct the correct equivalent circuit model of the device-under-test (DUT) in the frequency range of interest. Usually, fixture adaptors are necessary to serve as the interconnects between the DUT and the coaxial ports of the measurement instrument. To preserve measurement accuracy, the parasitic effects of these fixtures must be de-embedded. The first paper, “Impedance Corrected De-Embedding,” introduces a method of impedance corrected de-embedding and its associated advantages.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Impedance Corrected De-Embedding

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      Authors: Jason J. Ellison;Sedig S. Agili;
      Pages: 45 - 48
      Abstract: The 2x-thru, the most common standard used for creating fixture models, is never identical to the Fixture-DUT-Fixture due to printed circuit board (PCB) process variation. This difference leads to de-embedding error in the frequency and time domain. This paper introduces a method of impedance corrected de-embedding and its associated advantages. Impedance corrected de-embedding removes the error from differences between the Fixture-DUT-Fixture and reference 2x-thru impedance by implementing a peeling process. Further, the method is inherently more robust, because the fixture manufacturing tolerances do not impact the de-embedding results.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • A Multi-Frequency 3D Printed Hand Phantom for Electromagnetic Measurements

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      Authors: Brian B. Beard;Maria I. Iacono;Joshua W. Guag;Yongkang Liu;
      Pages: 49 - 54
      Abstract: It has been shown that the presence of a hand holding a wireless handset (cell phone) can influence antenna efficiency and the measurement of specific absorption rate (SAR) and electromagnetic compatibility. Head phantoms, used in handset compliance testing to estimate SAR in the head, have achieved low cost and multi-frequency use. Head phantoms typically consist of a thin plastic shell, open on the top, holding a tissue simulating fluid. The specific simulant fluid used is determined by the radio frequency of the test. IEC 62209–1 has recipes, using safe nontoxic materials, for all the required frequency bands. Thus, head phantoms can be reused at different frequencies simply by changing the tissue simulating fluid. However, standards have not adopted the use of hand phantoms because SAR limits in limbs are less restrictive than the head, the tissue depth in a hand is insufficient to make accurate measurements with current electric field probes, and the cost of a solid hand phantom is limited to a single frequency band. Our goal was to determine whether 3D printing techniques would allow the construction of a hand phantom with the same utility as existing head phantoms. We developed this phantom based on computer simulations to determine how much human anatomy needed to be included in the phantom to obtain results consistent with actual use. Electric field scans of a handset alone, and held by the hand phantom, were performed. Comparison of handset scans using the phantom and human subjects was planned, but not performed due to Covid-19 restrictions and subsequent changes in priorities. We feel a fluid-filled 3D printed hand phantom is viable and practical. The 3D print files are available on GitHub.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Common- and Differential-Mode Conducted Emissions Measurements using
           Conventional Receivers versus FFT-Based Receivers

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      Authors: M. Bosi;A.-M. Sánchez;F.J Pajares;I. García;J. Accensi;J.R. Regué;
      Pages: 55 - 63
      Abstract: Electromagnetic interference (EMI) instrumentation has significantly evolved over the last thirty years. In this paper, the classical architecture of a conventional receiver is described and compared with the newest architecture of a Fast-Fourier-transform (FFT) based receiver. Additionally, different ways to measure the modal emissions, that is, the common and differential modes, with both types of receivers are described. In a conventional receiver, modal emissions can be measured using an external noise separator. In a dual-port FFT-based receiver, this can be done in the digital domain. Both receivers have been used to measure a device under test emitting non-stationary interference.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Workshops and Tutorials in Spokane

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      Authors: John Maas;Flavia Grassi;
      Pages: 64 - 64
      Abstract: Now that the 2022 IEEE International Symposium on EMC+SIPI has completed its successful week in Spokane, Washington, the symposium organizing committee can breathe a collective sigh of relief. The first in-person EMC Society Symposium after two years of pandemic-induced virtual gatherings provided an excellent opportunity for EMC and SIPI professionals to come together once again to exchange ideas, network, and learn. With a record number of submissions, the Spokane workshop and tutorial program certainly contributed to all of those activities. As the organizers of that part of the symposium technical program, we would like to extend a huge thank you to our colleagues who proposed ideas, organized individual workshops or tutorials, prepared and presented material that made the program a success, and contributed to the discussion in these technical sessions.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Experiments and Demonstrations at EMC+SIPI 2022

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      Authors: Jacob Dixon;Gabe Alcala;
      Pages: 65 - 69
      Abstract: Presents information on the 2022 IEEE International Symposium on Electromagnetic Compatibility (EMC), Signal and Power Integrity (SIPI).
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Call for Experiments and Demonstrations Proposals!

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      Pages: 69 - 69
      Abstract: Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • News on 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids,
           Michigan

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      Pages: 70 - 70
      Abstract: Presents information on the 2023 IEEE International Symposium on EMC+SIPI.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Reminder: Fellow Nominations for the Class of 2024 are Due March 1, 2023

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      Authors: Chuck Bunting;
      Pages: 73 - 73
      Abstract: Greetings!, I hope that you will consider a colleague's (or maybe your own!) contribution to IEEE and begin thinking about honoring them with a nomination as an IEEE Fellow.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • New Members of the EMC Society Board of Directors Announced!

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      Pages: 73 - 73
      Abstract: Presents a listing of the editorial board, board of governors, current staff, committee members, and/or society editors for this issue of the publication.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Report on 2022 ESA Workshop on Aerospace EMC

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      Authors: Johannes Wolf;
      Pages: 74 - 76
      Abstract: The 2022 ESA Workshop on Aerospace EMC was planned to be held in Potsdam, Germany on May 23–25 at the NH Potsdam Voltaire Hotel, organized by the European Space Agency (ESA) with co-sponsorship of the IEEE EMC Society. Unfortunately in February 2022, due to the unclear Covid situation we had to re-organize the workshop as a fully virtual event. This happened for the first time in the series 2019 (Budapest), 2016 (Valencia), 2012 (Venice), and 2009 (Florence). The organizers strive to hold these events every three years, so it was preferred to hold it virtually rather than postponing it, also considering the advanced status of the preparation (papers already submitted and reviewed). The Technical Program Committee as usual comprised a mix of members from various national space agencies, industry contractors and suppliers, as well as from academia.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Technical Theme Topics

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      Authors: Flavia Grassi;
      Pages: 77 - 77
      Abstract: The first time I heard the term TEMPEST I was a student attending the first lecture of an EMC course reading the first chapter of Prof. Clayton R. Paul's textbook “Introduction to EMC.” At that time, the possibility to retrieve sensitive information by interception of electromagnetic emissions from electronic devices was perceived as a problem of a few people. Prof. Paul reported that containing this problem was imperative for the military as well as for companies to protect trade secrets. Our modern society and lifestyle have significantly changed this perception, and protecting our data and privacy from cyberattacks is now-adays a primary task.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Recent Trends in Image Information Recovery Using Leaked Electromagnetic
           Wave from Electronic Equipment

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      Authors: Dong-Hoon Choi;Euibum Lee;Taesik Nam;Jong-Gwan Yook;
      Pages: 77 - 83
      Abstract: Information input/output technology has been employed in various fields in our modern lives, and it is almost impossible for society to function without the devices based on this technology. Therefore, security issues associated with such electronic devices have attracted extensive attention. This study thoroughly reviews various TEMPEST-related research outcomes and trends. It contains both conventional and deep learning-based image processing techniques and research involving realistic scenarios, including concrete walls, information recovery under multiple devices, and reconstruction of color information.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Simultaneous Security and EMC Evaluations Based on Measuring
           Electromagnetic Field Distribution on PCBs

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      Authors: Youngwoo Kim;Daisuke Fujimoto;Yuichi Hayashi;
      Pages: 84 - 92
      Abstract: This article introduces a method to simultaneously evaluate the security and electromagnetic compatibility (EMC) of information devices equipped with cryptographic modules by measuring the electromagnetic (EM) field distribution on a printed circuit board (PCB). The proposed method requires a single correlation analysis above the cryptographic integrated circuit (IC) to define the frequency band of the EM field containing the secret information. Then, focusing on the radiation intensity in the frequency domain, an efficient method capable of obtaining the EM field distribution that contributes to the leakage of confidential information is proposed. Simultaneous EMC and security evaluations can be conducted by analyzing the obtained EM field distribution. Using the proposed method, EM field radiation and information leakage of an actual cryptographic device are analyzed. Compared to conventional methods requiring a large computational resource and analysis time, the proposed method can efficiently obtain the distribution of electric and magnetic fields that cause leakage of confidential information. Lastly, discussion, design guide, and future research directions are briefly provided.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Student EMC Hardware Design Contest 2022

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      Authors: Pavithrakrishnan Radhakrishnan;
      Pages: 93 - 94
      Abstract: Greetings! I am elated to write an article for the IEEE EMC Magazine on the “Student EMC Hardware Design Contest 2022” as part of the 2022 IEEE International Symposium on EMC+SIPI in Spokane, Washington (August 1–5, 2022).
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • News on 2023 Student EMC Hardware Design Contest

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      Pages: 95 - 95
      Abstract: Presents information on the 2023 Student EMC Hardware Design Contest.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Participants Reach New Heights at Spokane's Youth Technical Program

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      Authors: Stephanie Zajac;
      Pages: 96 - 96
      Abstract: The 2022 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity returned to an in-person format in August, after two years of a virtual conference format. Along with the return of the in-person format for the Symposium came the return of the Youth Technical Program (YTP), an opportunity for children of attendees, ages 6 - 16, to participate in the Symposium.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Young Professionals EMC

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      Authors: Patrick DeRoy;
      Pages: 97 - 99
      Abstract: Greetings Young Professionals! I hope you are well and having a great year 2022. If you were in Spokane, Washington for the 2022 IEEE International Symposium on EMC+SIPI from August 1 to 5, you'll enjoy reminiscing as you read this article. The pictures tell the stories of what was an incredibly fun time and a long awaited in-person gathering for our EMC+SIPI community. If you couldn't make it this year, we'll catch you up on what went on in Spokane and I'd encourage you to consider making plans to attend the 2023 Symposium in Grand Rapids, Michigan!
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • STANDARDS WEEK 2022: Standards Activities at the EMC+SIPI Symposium in
           Spokane, Washington

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      Authors: Ed Hare;Ross Carlton;
      Pages: 100 - 102
      Abstract: We had a great Standards Week during the Spokane Symposium with many opportunities to learn about or engage in Standards activities. We organized committee meetings, presentations, and tutorials related to Standards. The Standards meetings were OPEN to all who wanted to attend. There was no registration fee, membership, or anything else required to attend, only an interest in Standards.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • IBIS Update: 2022 IEEE International Symposium on Electromagnetic
           Compatibility, Signal & Power Integrity (EMC+SIPI)

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      Authors: Randy Wolff;Zhiping Yang;
      Pages: 103 - 104
      Abstract: The 2022 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) featured the third year of collaboration between the IEEE EMC Society and the IBIS Open Forum. Two events adding SI and PI content to the symposium included the IBIS “Ask the Experts” panel on August 4th and the IBIS Open Forum Summit on August 5th.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Spokane Symposium Highlights

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      Pages: 105 - 106
      Abstract: Presents information on the Spokane Symposium.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • EMC Spotlight

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      Authors: Carlos Sartori;
      Pages: 107 - 113
      Abstract: Reports on news of interest to EMC society members.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
  • Calendar

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      Pages: 114 - 116
      Abstract: Presents the MMTS calendar of upcoming events and meetings.
      PubDate: 3rd Quarter 2022
      Issue No: Vol. 11, No. 3 (2022)
       
 
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