Subjects -> MANUFACTURING AND TECHNOLOGY (Total: 363 journals)
    - CERAMICS, GLASS AND POTTERY (31 journals)
    - MACHINERY (34 journals)
    - PACKAGING (19 journals)
    - PLASTICS (42 journals)
    - RUBBER (4 journals)

PACKAGING (19 journals)

Showing 1 - 17 of 17 Journals sorted alphabetically
Asian Journal of Shipping and Logistics     Open Access   (Followers: 2)
Canadian Journal on Aging     Hybrid Journal   (Followers: 17)
European Journal of Ageing     Hybrid Journal   (Followers: 16)
Food Packaging and Shelf Life     Hybrid Journal   (Followers: 3)
IEEE Transactions on Components and Packaging Technologies     Full-text available via subscription   (Followers: 17)
International Journal of Aging and Human Development     Full-text available via subscription   (Followers: 11)
Journal of Aerosol Science     Hybrid Journal   (Followers: 7)
Journal of Applied Packaging Research     Open Access   (Followers: 1)
Journal of Electronic Packaging     Full-text available via subscription   (Followers: 15)
Journal of Manufacturing and Materials Processing     Open Access  
Journal of Microelectronics and Electronic Packaging     Hybrid Journal   (Followers: 2)
Journal of Packaging Technology and Research     Hybrid Journal  
Packaging Technology and Science     Hybrid Journal   (Followers: 6)
Packaging, Transport, Storage & Security of Radioactive Material     Hybrid Journal   (Followers: 2)
Psychology and Aging     Full-text available via subscription   (Followers: 16)
Rejuvenation Research     Hybrid Journal  
Research on Aging     Hybrid Journal   (Followers: 13)
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Journal of Electronic Packaging
Journal Prestige (SJR): 0.569
Citation Impact (citeScore): 2
Number of Followers: 15  
  Full-text available via subscription Subscription journal
ISSN (Print) 1528-9044 - ISSN (Online) 1043-7398
Published by ASME International Homepage  [25 journals]
  • Analytical Multi-Parametric Design Optimization for the Miniaturization of
           Flip-Chip Package

    • Free pre-print version: Loading...

      Authors: Ng F; Abas M.
      First page: 041009
      Abstract: AbstractRecent advances in the micro-electronics industry have increased the demand for smaller and more compact package devices with higher performance. This paper presents an analytical multiparametric design optimization approach for the miniaturization of flip-chip package, while considering the filling time of the subsequent underfill encapsulation process. The design optimization approach was based on the latest regional segregation-based analytical filling time model. Numerical simulation was conducted to verify the governed analytical model. The discrepancies in the filling times are less than 9.9%, and the predicted critical bump pitch has a low deviation of 4.1%, affirming that both the analytical and numerical models were in great consensus. The variation effects of bump pitch, gap height, and contact angle on the filling time were analyzed and discussed thoroughly. Both the critical bump pitch and the critical gap height were computed and fitted into respective empirical equations. Subsequently, a new multiparametric design optimization approach based on the thresholding and criticality of underfill parameters was proposed to determine the optimum parameters that yield to the most compact flip-chip package with acceptable low filling time during the encapsulation process. Lastly, this proposed optimization technique was tested on the four flip-chips used in a previously published underfill experiment.
      PubDate: Thu, 01 Dec 2022 00:00:00 GMT
      DOI: 10.1115/1.4052920
      Issue No: Vol. 144, No. 4 (2022)
School of Mathematical and Computer Sciences
Heriot-Watt University
Edinburgh, EH14 4AS, UK
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