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Showing 1 - 200 of 335 Journals sorted alphabetically
A Life in the Day     Hybrid Journal   (Followers: 12)
Academia Revista Latinoamericana de Administraci√≥n     Open Access   (Followers: 2, SJR: 0.144, h-index: 4)
Accounting Auditing & Accountability J.     Hybrid Journal   (Followers: 30)
Accounting Research J.     Hybrid Journal   (Followers: 24, SJR: 0.26, h-index: 7)
Accounting, Auditing and Accountability J.     Hybrid Journal   (Followers: 20, SJR: 0.88, h-index: 40)
Advances in Accounting Education     Hybrid Journal   (Followers: 15, SJR: 0.514, h-index: 5)
Advances in Appreciative Inquiry     Hybrid Journal   (SJR: 0.124, h-index: 5)
Advances in Autism     Hybrid Journal   (Followers: 12)
Advances in Dual Diagnosis     Hybrid Journal   (Followers: 46, SJR: 0.228, h-index: 2)
Advances in Gender Research     Full-text available via subscription   (Followers: 3, SJR: 0.229, h-index: 7)
Advances in Intl. Marketing     Full-text available via subscription   (Followers: 5, SJR: 0.123, h-index: 11)
Advances in Mental Health and Intellectual Disabilities     Hybrid Journal   (Followers: 59, SJR: 0.29, h-index: 5)
Advances in Mental Health and Learning Disabilities     Hybrid Journal   (Followers: 30)
African J. of Economic and Management Studies     Hybrid Journal   (Followers: 10, SJR: 0.125, h-index: 2)
Agricultural Finance Review     Hybrid Journal  
Aircraft Engineering and Aerospace Technology     Hybrid Journal   (Followers: 184, SJR: 0.391, h-index: 18)
American J. of Business     Hybrid Journal   (Followers: 17)
Annals in Social Responsibility     Full-text available via subscription  
Anti-Corrosion Methods and Materials     Hybrid Journal   (Followers: 11, SJR: 0.215, h-index: 25)
Arts and the Market     Hybrid Journal   (Followers: 8)
Asia Pacific J. of Marketing and Logistics     Hybrid Journal   (Followers: 8, SJR: 0.244, h-index: 15)
Asia-Pacific J. of Business Administration     Hybrid Journal   (Followers: 5, SJR: 0.182, h-index: 7)
Asian Association of Open Universities J.     Open Access  
Asian Education and Development Studies     Hybrid Journal   (Followers: 5)
Asian J. on Quality     Hybrid Journal   (Followers: 2)
Asian Review of Accounting     Hybrid Journal   (Followers: 2, SJR: 0.29, h-index: 7)
Aslib J. of Information Management     Hybrid Journal   (Followers: 25, SJR: 0.65, h-index: 29)
Aslib Proceedings     Hybrid Journal   (Followers: 283)
Assembly Automation     Hybrid Journal   (Followers: 2, SJR: 0.657, h-index: 26)
Baltic J. of Management     Hybrid Journal   (Followers: 3, SJR: 0.354, h-index: 14)
Benchmarking : An Intl. J.     Hybrid Journal   (Followers: 10, SJR: 0.556, h-index: 38)
British Food J.     Hybrid Journal   (Followers: 16, SJR: 0.329, h-index: 35)
Built Environment Project and Asset Management     Hybrid Journal   (Followers: 14, SJR: 0.232, h-index: 4)
Business Process Re-engineering & Management J.     Hybrid Journal   (Followers: 8, SJR: 0.614, h-index: 42)
Business Strategy Series     Hybrid Journal   (Followers: 6, SJR: 0.201, h-index: 6)
Career Development Intl.     Hybrid Journal   (Followers: 17, SJR: 0.686, h-index: 32)
China Agricultural Economic Review     Hybrid Journal   (Followers: 2, SJR: 0.238, h-index: 10)
China Finance Review Intl.     Hybrid Journal   (Followers: 5)
Chinese Management Studies     Hybrid Journal   (Followers: 4, SJR: 0.216, h-index: 12)
Circuit World     Hybrid Journal   (Followers: 15, SJR: 0.346, h-index: 17)
Collection Building     Hybrid Journal   (Followers: 11, SJR: 0.829, h-index: 10)
COMPEL: The Intl. J. for Computation and Mathematics in Electrical and Electronic Engineering     Hybrid Journal   (Followers: 3, SJR: 0.269, h-index: 22)
Competitiveness Review : An Intl. Business J. incorporating J. of Global Competitiveness     Hybrid Journal   (Followers: 5)
Construction Innovation: Information, Process, Management     Hybrid Journal   (Followers: 14, SJR: 0.508, h-index: 8)
Corporate Communications An Intl. J.     Hybrid Journal   (Followers: 7, SJR: 0.703, h-index: 26)
Corporate Governance Intl. J. of Business in Society     Hybrid Journal   (Followers: 7, SJR: 0.309, h-index: 29)
Critical Perspectives on Intl. Business     Hybrid Journal   (SJR: 0.32, h-index: 15)
Cross Cultural & Strategic Management     Hybrid Journal   (Followers: 8, SJR: 0.356, h-index: 13)
Development and Learning in Organizations     Hybrid Journal   (Followers: 7, SJR: 0.138, h-index: 8)
Digital Library Perspectives     Hybrid Journal   (Followers: 21)
Direct Marketing An Intl. J.     Hybrid Journal   (Followers: 6)
Disaster Prevention and Management     Hybrid Journal   (Followers: 22, SJR: 0.533, h-index: 32)
Drugs and Alcohol Today     Hybrid Journal   (Followers: 133, SJR: 0.241, h-index: 4)
Education + Training     Hybrid Journal   (Followers: 22, SJR: 0.532, h-index: 30)
Education, Business and Society : Contemporary Middle Eastern Issues     Hybrid Journal   (Followers: 1, SJR: 0.141, h-index: 10)
Emerald Emerging Markets Case Studies     Hybrid Journal   (Followers: 1)
Employee Relations     Hybrid Journal   (Followers: 6, SJR: 0.435, h-index: 22)
Engineering Computations     Hybrid Journal   (Followers: 3, SJR: 0.387, h-index: 39)
Engineering, Construction and Architectural Management     Hybrid Journal   (Followers: 10, SJR: 0.541, h-index: 28)
Equal Opportunities Intl.     Hybrid Journal   (Followers: 3)
Equality, Diversity and Inclusion : An Intl. J.     Hybrid Journal   (Followers: 13, SJR: 0.239, h-index: 9)
EuroMed J. of Business     Hybrid Journal   (Followers: 1, SJR: 0.145, h-index: 9)
European Business Review     Hybrid Journal   (Followers: 8, SJR: 0.481, h-index: 21)
European J. of Innovation Management     Hybrid Journal   (Followers: 23, SJR: 0.596, h-index: 30)
European J. of Marketing     Hybrid Journal   (Followers: 21, SJR: 0.933, h-index: 55)
European J. of Training and Development     Hybrid Journal   (Followers: 9, SJR: 0.489, h-index: 23)
Evidence-based HRM     Hybrid Journal   (Followers: 5)
Facilities     Hybrid Journal   (Followers: 2, SJR: 0.371, h-index: 18)
Foresight     Hybrid Journal   (Followers: 7, SJR: 0.486, h-index: 20)
Gender in Management : An Intl. J.     Hybrid Journal   (Followers: 17, SJR: 0.359, h-index: 22)
Grey Systems : Theory and Application     Hybrid Journal   (Followers: 1)
Health Education     Hybrid Journal   (Followers: 2, SJR: 0.383, h-index: 17)
Higher Education, Skills and Work-based Learning     Hybrid Journal   (Followers: 45, SJR: 0.172, h-index: 4)
History of Education Review     Hybrid Journal   (Followers: 12, SJR: 0.141, h-index: 2)
Housing, Care and Support     Hybrid Journal   (Followers: 8, SJR: 0.174, h-index: 4)
Human Resource Management Intl. Digest     Hybrid Journal   (Followers: 17, SJR: 0.121, h-index: 6)
Humanomics     Hybrid Journal   (Followers: 2, SJR: 0.14, h-index: 4)
IMP J.     Hybrid Journal  
Indian Growth and Development Review     Hybrid Journal   (SJR: 0.163, h-index: 4)
Industrial and Commercial Training     Hybrid Journal   (Followers: 5, SJR: 0.217, h-index: 14)
Industrial Lubrication and Tribology     Hybrid Journal   (Followers: 5, SJR: 0.322, h-index: 19)
Industrial Management & Data Systems     Hybrid Journal   (Followers: 7, SJR: 0.63, h-index: 69)
Industrial Robot An Intl. J.     Hybrid Journal   (Followers: 2, SJR: 0.375, h-index: 32)
Info     Hybrid Journal   (Followers: 1, SJR: 0.25, h-index: 21)
Information and Computer Security     Hybrid Journal   (Followers: 22)
Information Technology & People     Hybrid Journal   (Followers: 43, SJR: 0.576, h-index: 28)
Interactive Technology and Smart Education     Hybrid Journal   (Followers: 11, SJR: 0.112, h-index: 1)
Interlending & Document Supply     Hybrid Journal   (Followers: 60, SJR: 0.48, h-index: 13)
Internet Research     Hybrid Journal   (Followers: 36, SJR: 1.746, h-index: 57)
Intl. J. for Lesson and Learning Studies     Hybrid Journal   (Followers: 4)
Intl. J. for Researcher Development     Hybrid Journal   (Followers: 9)
Intl. J. of Accounting and Information Management     Hybrid Journal   (Followers: 9, SJR: 0.304, h-index: 7)
Intl. J. of Bank Marketing     Hybrid Journal   (Followers: 8, SJR: 0.515, h-index: 38)
Intl. J. of Climate Change Strategies and Management     Hybrid Journal   (Followers: 14, SJR: 0.416, h-index: 7)
Intl. J. of Clothing Science and Technology     Hybrid Journal   (Followers: 6, SJR: 0.279, h-index: 25)
Intl. J. of Commerce and Management     Hybrid Journal   (Followers: 1)
Intl. J. of Conflict Management     Hybrid Journal   (Followers: 14, SJR: 0.763, h-index: 38)
Intl. J. of Contemporary Hospitality Management     Hybrid Journal   (Followers: 12, SJR: 1.329, h-index: 35)
Intl. J. of Culture Tourism and Hospitality Research     Hybrid Journal   (Followers: 18, SJR: 0.399, h-index: 5)
Intl. J. of Development Issues     Hybrid Journal   (Followers: 9)
Intl. J. of Disaster Resilience in the Built Environment     Hybrid Journal   (Followers: 6, SJR: 0.225, h-index: 7)
Intl. J. of Educational Management     Hybrid Journal   (Followers: 5, SJR: 0.424, h-index: 32)
Intl. J. of Emergency Services     Hybrid Journal   (Followers: 6, SJR: 0.179, h-index: 1)
Intl. J. of Emerging Markets     Hybrid Journal   (Followers: 3, SJR: 0.199, h-index: 5)
Intl. J. of Energy Sector Management     Hybrid Journal   (Followers: 2, SJR: 0.25, h-index: 12)
Intl. J. of Entrepreneurial Behaviour & Research     Hybrid Journal   (Followers: 4, SJR: 0.694, h-index: 28)
Intl. J. of Event and Festival Management     Hybrid Journal   (Followers: 5, SJR: 0.32, h-index: 8)
Intl. J. of Gender and Entrepreneurship     Hybrid Journal   (Followers: 5, SJR: 0.638, h-index: 6)
Intl. J. of Health Care Quality Assurance     Hybrid Journal   (Followers: 11, SJR: 0.352, h-index: 32)
Intl. J. of Health Governance     Hybrid Journal   (Followers: 26, SJR: 0.277, h-index: 15)
Intl. J. of Housing Markets and Analysis     Hybrid Journal   (Followers: 9, SJR: 0.201, h-index: 5)
Intl. J. of Human Rights in Healthcare     Hybrid Journal   (Followers: 6, SJR: 0.13, h-index: 2)
Intl. J. of Information and Learning Technology     Hybrid Journal   (Followers: 7)
Intl. J. of Innovation Science     Hybrid Journal   (Followers: 10, SJR: 0.173, h-index: 5)
Intl. J. of Intelligent Computing and Cybernetics     Hybrid Journal   (Followers: 3, SJR: 0.258, h-index: 10)
Intl. J. of Intelligent Unmanned Systems     Hybrid Journal   (Followers: 4, SJR: 0.145, h-index: 2)
Intl. J. of Islamic and Middle Eastern Finance and Management     Hybrid Journal   (Followers: 9)
Intl. J. of Law and Management     Hybrid Journal   (Followers: 2, SJR: 0.107, h-index: 2)
Intl. J. of Law in the Built Environment     Hybrid Journal   (Followers: 3, SJR: 0.111, h-index: 2)
Intl. J. of Leadership in Public Services     Hybrid Journal   (Followers: 18)
Intl. J. of Lean Six Sigma     Hybrid Journal   (Followers: 5, SJR: 0.562, h-index: 15)
Intl. J. of Logistics Management     Hybrid Journal   (Followers: 10, SJR: 0.998, h-index: 15)
Intl. J. of Managerial Finance     Hybrid Journal   (Followers: 5, SJR: 0.212, h-index: 11)
Intl. J. of Managing Projects in Business     Hybrid Journal   (Followers: 2)
Intl. J. of Manpower     Hybrid Journal   (Followers: 2, SJR: 0.354, h-index: 37)
Intl. J. of Mentoring and Coaching in Education     Hybrid Journal   (Followers: 24)
Intl. J. of Migration, Health and Social Care     Hybrid Journal   (Followers: 11, SJR: 0.261, h-index: 5)
Intl. J. of Numerical Methods for Heat & Fluid Flow     Hybrid Journal   (Followers: 11, SJR: 0.594, h-index: 32)
Intl. J. of Operations & Production Management     Hybrid Journal   (Followers: 18, SJR: 2.198, h-index: 94)
Intl. J. of Organizational Analysis     Hybrid Journal   (Followers: 3, SJR: 0.222, h-index: 11)
Intl. J. of Pervasive Computing and Communications     Hybrid Journal   (Followers: 3, SJR: 0.165, h-index: 9)
Intl. J. of Pharmaceutical and Healthcare Marketing     Hybrid Journal   (Followers: 4, SJR: 0.304, h-index: 12)
Intl. J. of Physical Distribution & Logistics Management     Hybrid Journal   (Followers: 11, SJR: 1.694, h-index: 66)
Intl. J. of Prisoner Health     Hybrid Journal   (Followers: 10, SJR: 0.254, h-index: 10)
Intl. J. of Productivity and Performance Management     Hybrid Journal   (Followers: 7, SJR: 0.785, h-index: 31)
Intl. J. of Public Sector Management     Hybrid Journal   (Followers: 23, SJR: 0.272, h-index: 37)
Intl. J. of Quality & Reliability Management     Hybrid Journal   (Followers: 7, SJR: 0.544, h-index: 63)
Intl. J. of Quality and Service Sciences     Hybrid Journal   (Followers: 2, SJR: 0.133, h-index: 1)
Intl. J. of Retail & Distribution Management     Hybrid Journal   (Followers: 6, SJR: 0.543, h-index: 36)
Intl. J. of Service Industry Management     Hybrid Journal   (Followers: 2)
Intl. J. of Social Economics     Hybrid Journal   (Followers: 5, SJR: 0.227, h-index: 25)
Intl. J. of Sociology and Social Policy     Hybrid Journal   (Followers: 49, SJR: 0.361, h-index: 5)
Intl. J. of Sports Marketing and Sponsorship     Hybrid Journal   (Followers: 1)
Intl. J. of Structural Integrity     Hybrid Journal   (Followers: 2, SJR: 0.325, h-index: 8)
Intl. J. of Sustainability in Higher Education     Hybrid Journal   (Followers: 13, SJR: 0.616, h-index: 29)
Intl. J. of Tourism Cities     Hybrid Journal   (Followers: 2)
Intl. J. of Web Information Systems     Hybrid Journal   (Followers: 4, SJR: 0.208, h-index: 13)
Intl. J. of Wine Business Research     Hybrid Journal   (Followers: 7, SJR: 0.196, h-index: 12)
Intl. J. of Workplace Health Management     Hybrid Journal   (Followers: 11, SJR: 0.358, h-index: 8)
Intl. Marketing Review     Hybrid Journal   (Followers: 16, SJR: 1.076, h-index: 57)
J. for Multicultural Education     Hybrid Journal   (Followers: 1, SJR: 0.124, h-index: 11)
J. of Accounting & Organizational Change     Hybrid Journal   (Followers: 5, SJR: 0.346, h-index: 7)
J. of Accounting in Emerging Economies     Hybrid Journal   (Followers: 8)
J. of Adult Protection, The     Hybrid Journal   (Followers: 15, SJR: 0.291, h-index: 7)
J. of Advances in Management Research     Hybrid Journal   (Followers: 2)
J. of Aggression, Conflict and Peace Research     Hybrid Journal   (Followers: 48, SJR: 0.177, h-index: 9)
J. of Agribusiness in Developing and Emerging Economies     Hybrid Journal  
J. of Applied Accounting Research     Hybrid Journal   (Followers: 16, SJR: 0.22, h-index: 5)
J. of Applied Research in Higher Education     Hybrid Journal   (Followers: 49)
J. of Asia Business Studies     Hybrid Journal   (Followers: 2, SJR: 0.115, h-index: 1)
J. of Assistive Technologies     Hybrid Journal   (Followers: 19, SJR: 0.215, h-index: 6)
J. of Business & Industrial Marketing     Hybrid Journal   (Followers: 8, SJR: 0.664, h-index: 48)
J. of Business Strategy     Hybrid Journal   (Followers: 11, SJR: 0.381, h-index: 17)
J. of Centrum Cathedra     Open Access  
J. of Children's Services     Hybrid Journal   (Followers: 5, SJR: 0.167, h-index: 9)
J. of Chinese Economic and Foreign Trade Studies     Hybrid Journal   (Followers: 1, SJR: 0.188, h-index: 4)
J. of Chinese Entrepreneurship     Hybrid Journal   (Followers: 4)
J. of Chinese Human Resource Management     Hybrid Journal   (Followers: 6, SJR: 0.112, h-index: 3)
J. of Communication Management     Hybrid Journal   (Followers: 6, SJR: 0.735, h-index: 6)
J. of Consumer Marketing     Hybrid Journal   (Followers: 18, SJR: 0.613, h-index: 62)
J. of Corporate Real Estate     Hybrid Journal   (Followers: 3, SJR: 0.633, h-index: 5)
J. of Criminal Psychology     Hybrid Journal   (Followers: 119, SJR: 0.13, h-index: 1)
J. of Criminological Research, Policy and Practice     Hybrid Journal   (Followers: 52)
J. of Cultural Heritage Management and Sustainable Development     Hybrid Journal   (Followers: 10, SJR: 0.109, h-index: 5)
J. of Documentation     Hybrid Journal   (Followers: 168, SJR: 0.936, h-index: 50)
J. of Economic and Administrative Sciences     Hybrid Journal   (Followers: 2)
J. of Economic Studies     Hybrid Journal   (Followers: 5, SJR: 0.498, h-index: 26)
J. of Educational Administration     Hybrid Journal   (Followers: 6, SJR: 0.848, h-index: 36)
J. of Engineering, Design and Technology     Hybrid Journal   (Followers: 16, SJR: 0.173, h-index: 10)
J. of Enterprise Information Management     Hybrid Journal   (Followers: 4, SJR: 0.433, h-index: 38)
J. of Enterprising Communities People and Places in the Global Economy     Hybrid Journal   (Followers: 1, SJR: 0.212, h-index: 8)
J. of Entrepreneurship and Public Policy     Hybrid Journal   (Followers: 8)
J. of European Industrial Training     Hybrid Journal   (Followers: 2)
J. of European Real Estate Research     Hybrid Journal   (Followers: 3, SJR: 0.52, h-index: 7)
J. of Facilities Management     Hybrid Journal   (Followers: 3)
J. of Family Business Management     Hybrid Journal   (Followers: 7)
J. of Fashion Marketing and Management     Hybrid Journal   (Followers: 12, SJR: 0.529, h-index: 30)
J. of Financial Crime     Hybrid Journal   (Followers: 365, SJR: 0.158, h-index: 5)
J. of Financial Economic Policy     Hybrid Journal   (Followers: 1)
J. of Financial Management of Property and Construction     Hybrid Journal   (Followers: 8, SJR: 0.234, h-index: 1)
J. of Financial Regulation and Compliance     Hybrid Journal   (Followers: 8)
J. of Financial Reporting and Accounting     Hybrid Journal   (Followers: 11)
J. of Forensic Practice     Hybrid Journal   (Followers: 56, SJR: 0.225, h-index: 8)
J. of Global Mobility     Hybrid Journal   (Followers: 2)
J. of Global Responsibility     Hybrid Journal   (Followers: 4)
J. of Health Organisation and Management     Hybrid Journal   (Followers: 21, SJR: 0.67, h-index: 27)
J. of Historical Research in Marketing     Hybrid Journal   (Followers: 4, SJR: 0.376, h-index: 8)
J. of Hospitality and Tourism Technology     Hybrid Journal   (Followers: 4, SJR: 0.672, h-index: 10)
J. of Human Resource Costing & Accounting     Hybrid Journal   (Followers: 4)
J. of Humanitarian Logistics and Supply Chain Management     Hybrid Journal   (Followers: 13)

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Journal Cover Circuit World
  [SJR: 0.346]   [H-I: 17]   [15 followers]  Follow
   Hybrid Journal Hybrid journal (It can contain Open Access articles)
   ISSN (Print) 0305-6120
   Published by Emerald Homepage  [335 journals]
  • Guest editorial
    • Pages: 1 - 1
      Abstract: Circuit World, Volume 44, Issue 1, Page 1-1, February 2018.

      Citation: Circuit World
      PubDate: 2018-02-12T02:07:30Z
      DOI: 10.1108/CW-02-2018-067
  • Technological aspects of silver particle sintering for electronic
    • Pages: 2 - 15
      Abstract: Circuit World, Volume 44, Issue 1, Page 2-15, February 2018.
      Purpose This paper aims to find proper technological parameters of low-temperature joining technique by silver sintering to eventually use this technique for reliable electronic packaging. Design/methodology/approach Based on the literature and author’s own experience, the factors influencing the nanosized Ag particle sintering results were identified, and their significance was assessed. Findings It has been shown that some important technological parameters clearly influence the quality of the joints, and their choice is unambiguous, but the meaning of some parameters is dependent on other factors (interactions), and they should be selected experimentally. Originality/value The value of this research is that the importance of all technological factors was analyzed, which makes it easy to choose the technological procedures in the electronic packaging.
      Citation: Circuit World
      PubDate: 2018-02-01T08:58:45Z
      DOI: 10.1108/CW-10-2017-0060
  • Thermal interface materials based on graphene and silver nanopowder
    • Pages: 16 - 20
      Abstract: Circuit World, Volume 44, Issue 1, Page 16-20, February 2018.
      Purpose The purpose of this paper is to present results of the studies on modification of ethylene-vinyl acetate (EVA) encapsulation foil to be used as thermal interface material (TIM). It is estimated that poor thermal management in electronic devices can cause over 50 per cent of failures. As the junction temperature rises, the failure rate for electronics increases exponentially. To ensure sufficient heat transfer from its source, TIMs are used in various circuits. On the other hand, it is important to ensure high electric resistivity of the designed TIM. Design/methodology/approach The focus of the investigation was twofold: modification of EVA with both graphene oxide (GO) and silver nanopowder (nAg); and TIM applicability through lamination of photovoltaic cells with standard and modified EVA foil. The main problem of a new type of encapsulant is proper gas evacuation during the lamination process. For this reason, reference and modified samples were compared taking into account the percentage of gas bubbles in visible volume of laminated TIM. Finally, reference and modified TIM samples were compared using differential scanning calorimetry (DSC) and laser flash analysis (LFA) measurements. Findings The proper parameters of the lamination process for the modified EVA foil - with both GO and organometallic nAg particles - were selected. The nAg addition results in an increase in thermal conductivity of the proposed compositions with respect to unmodified EVA foil, which was confirmed by DSC and LFA measurements. Originality/value The experiments confirmed the potential application of both EVA foil as a matrix for TIM material and nAg with GO as an active agent. Proposed composition can bring additional support to a solar cell or other electronic components through effective heat removal, which increases its performance.
      Citation: Circuit World
      PubDate: 2018-01-11T08:49:10Z
      DOI: 10.1108/CW-11-2017-0065
  • Packing density of inkjet printed paths
    • Pages: 21 - 28
      Abstract: Circuit World, Volume 44, Issue 1, Page 21-28, February 2018.
      Purpose This paper aims to study the packing density of printed paths on different substrate materials. It presents problems which appear when the necessity of printing one or more narrow paths occurs. Design/methodology/approach A piezoelectric printhead containing nozzles with a diameter of 35 µm was used for printing nanoparticle silver ink on different polymer substrates which were treated by plasma or not treated at all. The shape, defects, resistance and printing parameters for the printed paths were analysed. Findings The obtained results allow the identification of the sources of the technological problems in obtaining a high packing density of the paths in a small area of substrate and the repeatable prints. Research limitations/implications The study could have limited universality because of the chosen research method; printhead, ink, substrate materials and process parameters were arbitrarily selected. The authors encourage the study of other kinds of conductive inks, treatment methods and printing process parameters. Practical implications The study includes practically useful information about widths, shapes, defects and the resistance of the paths printed using different technological parameters. Originality/value The study presents the results of original empirical research on problems of the packing density of inkjet printed paths on a small area of substrate and identifies problems that must be resolved to obtain effective interconnections in the inkjet technology.
      Citation: Circuit World
      PubDate: 2018-01-15T12:52:01Z
      DOI: 10.1108/CW-10-2017-0055
  • Thermal stability analysis of passive components embedded into printed
           circuit boards
    • Pages: 29 - 36
      Abstract: Circuit World, Volume 44, Issue 1, Page 29-36, February 2018.
      Purpose The purpose of this paper is to investigate the behavior of embedded passives under changing temperature conditions. Influence of different temperature changes on the basic properties of embedded passives was analyzed. The main reason for these investigations was to determine functionality of passives for space application. Design/methodology/approach The investigations were based on the thin-film resistors made of Ni-P alloy, thick-film resistors made of carbon or carbon-silver inks, embedded capacitors made of FaradFlex materials and embedded inductor made in various configurations. Prepared samples were examined under the influence of a constant elevated temperature (100, 130 or 160°C) in a long period of time (minimum of 30 h), thermal cycles (from −40 to +85°C) or thermal shocks (from −40 to +105°C or from −40 to +125°C). Findings The achieved results revealed that resistance drift became bigger when the samples were treated at a higher constant temperature. At the same time, no significant difference in change in electrical properties for 50 and 100 Ω resistors was noticed. For all the tests, resistance change was below 2 per cent regardless of a value of the tested resistors. Conducted thermal shock studies indicate that thin-film resistors, coils and some thick-film resistors are characterized by minor variations in basic parameters. Some of the inks may show considerable resistance variations with temperature changes. Significant changes were also exhibited by embedded capacitors. Originality/value The knowledge about the behavior of the operating parameters of embedded components considering environmental conditions allow for development of more complex systems with integrated printed circuit boards.
      Citation: Circuit World
      PubDate: 2018-02-02T10:00:36Z
      DOI: 10.1108/CW-10-2017-0057
  • Solder joint quality evaluation based on heating factor
    • Pages: 37 - 44
      Abstract: Circuit World, Volume 44, Issue 1, Page 37-44, February 2018.
      Purpose The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor. Design/methodology/approach The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints. Findings The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s · K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease. Originality/value The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.
      Citation: Circuit World
      PubDate: 2018-01-08T03:41:44Z
      DOI: 10.1108/CW-10-2017-0059
  • ISFET structures with chemically modified membrane for bovine serum
           albumin detection
    • Pages: 45 - 50
      Abstract: Circuit World, Volume 44, Issue 1, Page 45-50, February 2018.
      Purpose The purpose of this paper is to present possibility of fast and certain identification of bovine serum albumin (BSA) by means of ion-sensitive field effect transistor (ISFET) structures. Because BSA can cause allergic reactions in humans, it is one of reasons for development of sensitive sensors to detect residual BSA. BSA is commonly used in biochemistry and molecular biology in laboratory experiments. Therefore, to better understand the mechanism of signal transduction in simulated biological environment and to elucidate the role of adsorption of biomolecules in the generation of a signal at the interface with biological systems, the measurements of ISFET current response in the presence of BSA as a reference protein molecule were performed. Design/methodology/approach To fabricate transistors, silicon technology was used. The ISFET structures were coupled to specially designed double-side printed circuit board holder. After modification of the field effect transistor (FET) device with 3-aminopropyltriethoxysilane (APTES), a sensor with high sensitivity toward reference biomolecules was obtained. The current–voltage (I-V) characteristics of structures with and without gate modification were measured. Keithley SMU 236/237/238 measurement set was used. Deionized water solution and 0.05 per cent BSA were used. Findings In this research, a method of preparation of a biosensor based on a FET was developed. Sensitivity of APTES-modified FET device toward BSA as a biomolecule was investigated. I-V relationships of FET devices (with and without modification), being the effect of the interactions with the solution containing 0.05 per cent BSA, were measured and compared to the measurements performed for solutions without BSA. Originality value Compared to SiO2-containing ISFETs without modification or other different dielectrics, the application of APTES as the part of the membrane induced significant increase in their sensitivity to BSA.
      Citation: Circuit World
      PubDate: 2018-01-11T08:54:08Z
      DOI: 10.1108/CW-10-2017-0061
  • Effects of microstrip line fabrication and design on high-speed signal
           integrity transmission of PCB manufacturing process
    • Abstract: Circuit World, Ahead of Print.
      Purpose As a common transmission line, the microstrip line plays an important role in high-speed circuits. The purpose of this paper was to investigate the effects of the circuit design of microstrip lines on the signal integrity (SI). In addition, the influence of the type and thickness of the solder resist ink on SI was analyzed to provide guidance for the related producing process design of printed circuit boards (PCBs). Design/methodology/approach Microstrip line properties consisting of shape, line-width/line-space ratio, reference layer design and as-covered solder resist ink were designed to measure the insertion loss (S21) in high-speed PCB. Findings The study showed that the insertion loss (S21) of straight, meander, snake-shaped and wavy microstrip lines was approximately consistent. A microstrip line with width/space ratio less than 0.96 is necessary, as the differential line closing produces a mutual interference. Reference layer including the discontinuous area should be repaired by adjusting the microstrip line parameters. With regard to the solder resist ink, the insertion loss of novel solder resist ink decreased by 0.163 dB/in at 12.9 GHz and 0.164 dB/in at 14 GHz, compared with traditional solder resist ink. Accordingly, the insertion loss effectively improved at a lower thickness of solder resist. Originality/value This paper demonstrated that the common designing factors of line shape, line/space ratio, reference layer and solder resist influence microstrip line SI in the significant reference of designer-making PCB layout.
      Citation: Circuit World
      PubDate: 2018-04-12T09:26:30Z
      DOI: 10.1108/CW-11-2017-0064
  • Sleep signal controlled footless domino circuit for low leakage current
    • Abstract: Circuit World, Ahead of Print.
      Purpose This paper aims to propose a new sleep signal controlled footless domino circuit for reducing the subthreshold and gate oxide leakage currents. Design/methodology/approach In the proposed circuit, a P channel MOSFET (PMOS) sleep switch transistor is inserted between the power supply and the output node. The sleep transistor, the source of the pull-down network, and the source of the N channel MOSFET (NMOS) transistor of the output inverter are controlled by this additional sleep signal to place the footless domino circuit in a low leakage state. Findings The authors simulate the proposed circuit by using HSPICE in 45-nm CMOS technology for OR and AND logic gates such as OR2, OR4, OR8, AND2 and AND4 at 25°C and 110°C. The proposed circuit reduces leakage power consumption as compared to the existing circuits. Originality/value The proposed circuit significantly reduces the total leakage power consumption up to 99.41 and 99.51 per cent as compared to the standard dual-threshold voltage footless domino circuits at 25°C and 110°C, respectively, and up to 93.79 and 97.98 per cent as compared to the sleep control techniques at 25°C and 110°C, respectively. Similarly, the proposed circuit reduces the active power consumption up to 26.76 and 86.25 per cent as compared to the standard dual-threshold voltage and sleep control techniques footless domino circuits at 25°C and 110°C, respectively.
      Citation: Circuit World
      PubDate: 2018-03-08T12:00:51Z
      DOI: 10.1108/CW-06-2017-0030
  • Smart home for elder care using wireless sensor
    • Abstract: Circuit World, Ahead of Print.
      Purpose The purpose of this paper is to explain, in brief, about smart, intelligent system which actively monitors the wellness of the elderly and will also send necessary alarms to the caretakers or doctors during an emergency because nowadays most of elderly people wish to stay alone independently. It is necessary to monitor their health conditions and activities continuously to prevent occurrence of health problems and also be able to provide medical assistance to them during emergencies. Design/methodology/approach The review paper describes the development of a methodology to monitor elderly continuously with a combination of advanced intelligent sensors, networking technologies and data processing system. Findings This paper identified various sensors used in smart home such as a pressure sensor, temperature sensor, etc., for monitoring elders health and their characteristics and also the cost, model number, etc., of various sensors available in the market. Originality/value This paper contains the comparison of various sensors available in the market that can be used in the smart home and also where we can use those sensors in smart home based on their characteristics.
      Citation: Circuit World
      PubDate: 2018-03-08T11:54:50Z
      DOI: 10.1108/CW-12-2017-0072
  • Design and analysis of cantilever based piezoelectric vibration energy
    • Abstract: Circuit World, Ahead of Print.
      Purpose This paper aims to present the design of a cantilever beam with various kinds of geometries for application in energy harvesting devices with a view to enhance the harvested power. The cantilever beams in rectangular, triangular and trapezoidal geometries are simulated, designed and evaluated experimentally. A power conditioning circuit is designed and fabricated for rectification and regulation. Design/methodology/approach The analytical model based on Euler–Bernoulli beam theory is analyzed for various cantilever geometries. The aluminum beam with Lead Zirconate Titanate (PZT) 5H strip is used for performing frequency, displacement, strain distribution, stress and potential analysis. A comparative analysis is done based on the estimated performance of the cantilevers with different topologies of 4,500 mm3 volume. Findings The analysis shows the trapezoidal cantilever yielding a maximum voltage of 66.13 V at 30 Hz. It exhibits maximum power density of 171.29 W/mm3 at optimal resistive load of 330 kΩ. The generated power of 770.8 µW is used to power up a C-mote wireless sensor network. Originality/value This study provides a complete structural analysis and implementation of the cantilever for energy harvesting application, integration of power conditioning circuit with the energy harvester and evaluation of the designed cantilevers under various performance metrics.
      Citation: Circuit World
      PubDate: 2018-02-23T11:17:38Z
      DOI: 10.1108/CW-11-2017-0067
  • Mechanism analysis of microvia filling based on multiphysics coupling
    • Abstract: Circuit World, Ahead of Print.
      Purpose Copper electrodeposition acts as a crucial step in the manufacture of high-density interconnect board. The stability of plating solution and the uniformity of copper electrodeposit are the hotspot and difficulty for the research of electrodeposition. Because a large number of factors are included in electrodeposition, experimentally determining all parameters and electrodeposition conditions becomes unmanageable. Therefore, a multiphysics coupling technology was introduced to investigate microvia filling process, and the mechanism of copper electrodeposition was analyzed. The results provide a strong theoretical basis and technical guidance for the actual electroplating experiments. The purpose of this paper is to provide an excellent tool for quickly and cheaply studying the process behavior of copper electrodeposition without actually needing to execute time-consuming and costly experiments. Design/methodology/approach The interactions among additives used in acidic copper plating solution for microvia filling and the effect on the copper deposition potential were characterized through galvanostatic measurement (GM). The adsorption behavior and surface coverage of additives with various concentrations under different rotating speeds of working electrode were investigated using cyclic voltammetry (CV) measurements. Further, a microvia filling model was constructed using multiphysics coupling technology based on the finite element method. Findings GM tests showed that accelerator, inhibitor and leveler affected the potential of copper electrodeposition, and bis(3-sulfopropyl) disulfide (SPS), ethylene oxide-propylene oxide (EO/PO) co-polymer, and self-made leveler were the effective additives in acidic copper plating solution. CV tests showed that EO/PO–Cu+-Cl− complex was adsorbed on the electrode surface by intermolecular forces, thus inhibiting copper electrodeposition. Numerical simulation indicated that the process of microvia filling included initial growth period, the outbreak period and the stable growth period, and modeling result was compared with the measured data, and a good agreement was observed. Research limitations/implications The research is still in progress with the development of high-performance computers. Practical implications A multiphysics coupling platform is an excellent tool for quickly and cheaply studying the electrodeposited process behaviors under a variety of operating conditions. Social implications The numerical simulation method has laid the foundation for mechanism of copper electrodeposition. Originality/value By using multiphysics coupling technology, the authors built a bridge between theoretical and experimental study for microvia filling. This method can help explain the mechanism of copper electrodeposition.
      Citation: Circuit World
      PubDate: 2018-01-15T10:48:01Z
      DOI: 10.1108/CW-06-2017-0029
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